Basavalingappa, Adarsh.
Overview
| Works: | 1 works in 0 publications in 0 languages | |
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Titles
Modeling and Studying the Effect of Texture and Elastic Anisotropy of Copper Microstructure in Nanoscale Interconnects on Reliability in Integrated Circuits.
by:
Basavalingappa, Adarsh.; State University of New York at Albany., Nanoscale Science and Engineering-Nanoscale Engineering.
(Electronic resources)