董鍾明
Overview
| Works: | 1 works in 0 publications in 0 languages | |
|---|---|---|
Titles
SoC趨勢下的封測技術變革與廠商發展策略 = = Changes in Package &Test Technologies & Development Strategies under SoC /
by:
董鍾明
(Language materials, printed)
先進封裝的關鍵零組件IC載板 = = The Key Componet of IC Package-IC Substrate /
by:
蕭傳議; 董鍾明; 駱韋仲
(Language materials, printed)
臺灣被動元件產業佈局馬來西亞與泰國之策略研究 = = Stragegic research feature on Taiwan passive component industry's layout in Malaysia and Thailand /
by:
董鍾明; 江柏風
(Language materials, printed)