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Chemical mechanical planarization.
概要
作品:
2 作品在 2 項出版品 2 種語言
書目資訊
Advances in chemical mechanical planarization (CMP) /
by:
(書目-電子資源)
Research on chemical mechanical polishing mechanism of novel diffusion barrier Ru for Cu interconnect
by:
(書目-電子資源)
主題
Manufacturing, Machines, Tools.
Chemical mechanical planarization.
Tribology, Corrosion and Coatings.
Microelectronics.
Ruthenium.
Electronics and Microelectronics, Instrumentation.
Nanoelectronics.
Engineering.
處理中
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