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Development of parylene/PDMS bi-laye...

Lee, Hyungsuk.

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Development of parylene/PDMS bi-layer coating and characterization using nanoindentation.

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Development of parylene/PDMS bi-layer coating and characterization using nanoindentation./
作者:	Lee, Hyungsuk.
面頁冊數:	98 p.
附註:	Adviser: Junghyun Cho.
Contained By:	Masters Abstracts International44-06.
標題:	Engineering, Materials Science. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1435195
ISBN:	9780542716287

Development of parylene/PDMS bi-layer coating and characterization using nanoindentation.
Lee, Hyungsuk.

Development of parylene/PDMS bi-layer coating and characterization using nanoindentation. - 98 p.

Adviser: Junghyun Cho.

Thesis (M.S.)--State University of New York at Binghamton, 2006.

Recent microelectronic devices and microelectromechanical systems (MEMS) introduce a number of packaging issues that are distinct and different from conventional electronic packaging as devices are becoming problematic. In addition, the packaging or encapsulation materials are often exposed to harsh environments where their performance can be drastically degraded. The use of polymers has been increasing in packaging applications, including substrates, adhesives, encapsulants, and overmolds of the components. Often the surface of these polymers needs to be effectively protected as they are not mechanically robust and may not possess sufficient hermetic protection.

ISBN: 9780542716287Subjects--Topical Terms:

1017759
Engineering, Materials Science.

Development of parylene/PDMS bi-layer coating and characterization using nanoindentation.
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502 $a Thesis (M.S.)--State University of New York at Binghamton, 2006.
520 $a Recent microelectronic devices and microelectromechanical systems (MEMS) introduce a number of packaging issues that are distinct and different from conventional electronic packaging as devices are becoming problematic. In addition, the packaging or encapsulation materials are often exposed to harsh environments where their performance can be drastically degraded. The use of polymers has been increasing in packaging applications, including substrates, adhesives, encapsulants, and overmolds of the components. Often the surface of these polymers needs to be effectively protected as they are not mechanically robust and may not possess sufficient hermetic protection.
520 $a The use of surface coatings on the polymer packages broadens their applications by providing a cost-effective solution for the protection of critical components. Elastomeric polydimethylsiloxane (PDMS) is a good candidate material for surface coatings or encapsulations. (Abstract shortened by UMI.)
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