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Process analysis and performance cha...

Ramkumar, S. Manian.

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Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly./
Author:	Ramkumar, S. Manian.
Description:	313 p.
Notes:	Adviser: Krishnaswami Srihari.
Contained By:	Dissertation Abstracts International68-11B.
Subject:	Engineering, Electronics and Electrical. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3289100
ISBN:	9780549326342

Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly.
Ramkumar, S. Manian.

Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly. - 313 p.

Adviser: Krishnaswami Srihari.

Thesis (Ph.D.)--State University of New York at Binghamton, 2007.

The electronics industry, in recent years, has been focusing on product miniaturization and lead-free assembly. The need for product miniaturization is due to the continuous demand for portable electronic products that are multifunctional, smaller and faster. The need for lead-free assembly is due to the European Union (EU) directive to ban lead from electronics. This has renewed the industry's interest in exploring the use of Electrically Conductive Adhesives (ECAs). The objective of this research was to investigate a novel Anisotropic Conductive Adhesive (novel ACA) as a means for lead-free surface mount assembly. The novel ACA, unlike traditional ACA, uses a magnetic field during curing to align the particles as columns in the Z-axis direction, and eliminates the need for pressure and the capture of particles. The formation of conductive columns eliminates bridging between adjacent pads, and has proven to be capable of accommodating varying lead configurations. The novel ACA also enables mass curing of the adhesive, thereby eliminating sequential assembly. The goals of this research were to characterize the material properties of the novel ACA, analyze the effect of the various process parameters, identify failures and investigate the long term reliability of the novel ACA for Level 2 surface mount assembly. Reliability testing included the investigation of the assembly performance in temperature and humidity aging, thermal aging, air-to-air thermal cycling, and drop testing conditions. The applicability of the novel conductive adhesive for board level assembly was successfully demonstrated. Research has shown the importance of achieving low initial contact resistance after assembly. Thermal aging of the adhesive material has revealed improvement in contact resistance. Temperature/humidity aging has shown deterioration in performance within the first 100 hours of aging. Component assembly analysis has revealed the importance of placement pressure, placement speed and placement dwell in achieving low initial contact resistance. Area array packages with bumps have provided consistent performance with low contact resistance. This research also indicates that noble finishes outperforms other lead-free finishes. In conclusion, this research study provided a good understanding of the use of the novel ACA for manufacturing reliable lead-free surface mount assemblies.

ISBN: 9780549326342Subjects--Topical Terms:

626636
Engineering, Electronics and Electrical.

Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly.
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020 $a 9780549326342
035 $a (UMI)AAI3289100
035 $a AAI3289100
040 $a UMI $c UMI
100 1 $a Ramkumar, S. Manian. $3 1279791
245 1 0 $a Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly.
300 $a 313 p.
500 $a Adviser: Krishnaswami Srihari.
500 $a Source: Dissertation Abstracts International, Volume: 68-11, Section: B, page: 7640.
502 $a Thesis (Ph.D.)--State University of New York at Binghamton, 2007.
520 $a The electronics industry, in recent years, has been focusing on product miniaturization and lead-free assembly. The need for product miniaturization is due to the continuous demand for portable electronic products that are multifunctional, smaller and faster. The need for lead-free assembly is due to the European Union (EU) directive to ban lead from electronics. This has renewed the industry's interest in exploring the use of Electrically Conductive Adhesives (ECAs). The objective of this research was to investigate a novel Anisotropic Conductive Adhesive (novel ACA) as a means for lead-free surface mount assembly. The novel ACA, unlike traditional ACA, uses a magnetic field during curing to align the particles as columns in the Z-axis direction, and eliminates the need for pressure and the capture of particles. The formation of conductive columns eliminates bridging between adjacent pads, and has proven to be capable of accommodating varying lead configurations. The novel ACA also enables mass curing of the adhesive, thereby eliminating sequential assembly. The goals of this research were to characterize the material properties of the novel ACA, analyze the effect of the various process parameters, identify failures and investigate the long term reliability of the novel ACA for Level 2 surface mount assembly. Reliability testing included the investigation of the assembly performance in temperature and humidity aging, thermal aging, air-to-air thermal cycling, and drop testing conditions. The applicability of the novel conductive adhesive for board level assembly was successfully demonstrated. Research has shown the importance of achieving low initial contact resistance after assembly. Thermal aging of the adhesive material has revealed improvement in contact resistance. Temperature/humidity aging has shown deterioration in performance within the first 100 hours of aging. Component assembly analysis has revealed the importance of placement pressure, placement speed and placement dwell in achieving low initial contact resistance. Area array packages with bumps have provided consistent performance with low contact resistance. This research also indicates that noble finishes outperforms other lead-free finishes. In conclusion, this research study provided a good understanding of the use of the novel ACA for manufacturing reliable lead-free surface mount assemblies.
590 $a School code: 0792.
650 4 $a Engineering, Electronics and Electrical. $3 626636
650 4 $a Engineering, System Science. $3 1018128
690 $a 0544
690 $a 0790
710 2 $a State University of New York at Binghamton. $b Systems Science. $3 1023839
773 0 $t Dissertation Abstracts International $g 68-11B.
790 $a 0792
790 1 0 $a Nagarur, Nagen $e committee member
790 1 0 $a Sammakia, Bahgat $e committee member
790 1 0 $a Santos, Daryl $e committee member
790 1 0 $a Srihari, Krishnaswami, $e advisor
791 $a Ph.D.
792 $a 2007
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3289100