Numerical simulation and experiments...
Wang, Bo.

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  • Numerical simulation and experiments of fatigue crack growth in multi-layer structures of MEMS and microelectronic devices.
  • 紀錄類型: 書目-語言資料,印刷品 : Monograph/item
    正題名/作者: Numerical simulation and experiments of fatigue crack growth in multi-layer structures of MEMS and microelectronic devices./
    作者: Wang, Bo.
    面頁冊數: 195 p.
    附註: Adviser: Thomas Siegmund.
    Contained By: Dissertation Abstracts International68-08B.
    標題: Engineering, Mechanical. -
    電子資源: http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3278693
    ISBN: 9780549167044
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