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Synthesis of tin, silver and their a...

Jiang, Hongjin.

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Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications.

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications./
作者:	Jiang, Hongjin.
面頁冊數:	188 p.
附註:	Adviser: C. P. Wong.
Contained By:	Dissertation Abstracts International69-04B.
標題:	Chemistry, Polymer. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3308773
ISBN:	9780549559825

Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications.
Jiang, Hongjin.

Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications. - 188 p.

Adviser: C. P. Wong.

Thesis (Ph.D.)--Georgia Institute of Technology, 2008.

SnPb solders have long been used as interconnect materials in microelectronic packaging. Due to the health threat of lead to human beings, the use of lead-free interconnect materials is imperative. Three kinds of lead-free interconnect materials are being investigated, namely lead-free metal solders (SnAg, SnAgCu, etc.), electrically conductive adhesives (ECAs) and carbon nanotubes (CNTs). However, there are still limitations for the full utilization of these lead-free interconnect materials in the microelectronic packaging, such as higher melting point of lead-free metal solders, lower electrical conductivity of the ECAs and poor adhesion of CNTs to substrates.

ISBN: 9780549559825Subjects--Topical Terms:

1018428
Chemistry, Polymer.

Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications.
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500 $a Source: Dissertation Abstracts International, Volume: 69-04, Section: B, page: 2565.
502 $a Thesis (Ph.D.)--Georgia Institute of Technology, 2008.
520 $a SnPb solders have long been used as interconnect materials in microelectronic packaging. Due to the health threat of lead to human beings, the use of lead-free interconnect materials is imperative. Three kinds of lead-free interconnect materials are being investigated, namely lead-free metal solders (SnAg, SnAgCu, etc.), electrically conductive adhesives (ECAs) and carbon nanotubes (CNTs). However, there are still limitations for the full utilization of these lead-free interconnect materials in the microelectronic packaging, such as higher melting point of lead-free metal solders, lower electrical conductivity of the ECAs and poor adhesion of CNTs to substrates.
520 $a This thesis is devoted to the research and development of low processing temperature lead-free interconnect materials for microelectronic packaging applications with an emphasis on fundamental studies of nanoparticles synthesis, dispersion and oxidation prevention, and nanocomposites fabrication.
520 $a Oxide-free tin (Sn), tin/silver (96.5Sn3.5Ag) and tin/silver/copper (96.5Sn3.0Ag0.5Cu) alloy nanoparticles with different sizes were synthesized by a low temperature chemical reduction method. Both size dependent melting point and latent heat of fusion of the synthesized nanoparticles were obtained. The nano lead-free solder pastes/composites created by dispersing the SnAg or SnAgCu alloy nanoparticles into an acidic type flux spread and wet on the cleaned copper surface at 220 to 230°C. This study demonstrated the feasibility of nano sized SnAg or SnAgCu alloy particle pastes for low processing temperature lead-free interconnect applications in microelectronic packaging.
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