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Reliability analysis considering pro...

Huang, Wei.

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Reliability analysis considering product performance degradation.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Reliability analysis considering product performance degradation./
Author:	Huang, Wei.
Description:	191 p.
Notes:	Director: Duane L. Dietrich.
Contained By:	Dissertation Abstracts International63-04B
Subject:	Engineering, Industrial -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3050366
ISBN:	0493649921

Reliability analysis considering product performance degradation.
Huang, Wei.

Reliability analysis considering product performance degradation. - 191 p.

Director: Duane L. Dietrich.

Thesis (Ph.D.)--The University of Arizona, 2002.

The analysis of products with competing hard and soft failure modes is presented in terms of distribution independence. Derivation and examples are included for the event when the product finally fails in a specific failure mode.

ISBN: 0493649921Subjects--Topical Terms:

1260336
Engineering, Industrial

Reliability analysis considering product performance degradation.
LDR:02411nam 2200301 a 45 001 936639
005 20110510
008 110510s2002 eng d
020 $a 0493649921
035 $a (UnM)AAI3050366
035 $a AAI3050366
040 $a UnM $c UnM
100 1 $a Huang, Wei. $3 1023420
245 1 0 $a Reliability analysis considering product performance degradation.
300 $a 191 p.
500 $a Director: Duane L. Dietrich.
500 $a Source: Dissertation Abstracts International, Volume: 63-04, Section: B, page: 2011.
502 $a Thesis (Ph.D.)--The University of Arizona, 2002.
520 $a The analysis of products with competing hard and soft failure modes is presented in terms of distribution independence. Derivation and examples are included for the event when the product finally fails in a specific failure mode.
520 $a This dissertation presents a statistical model and analysis procedure for product performance aging degradation data. This model takes into account the strictly increasing/decreasing nature of performance measurements at multiple observation times. Maximum likelihood estimation (MLE) is used to estimate the time varying parameters of the proposed statistical model. The analysis of both generated data and field data is presented.
520 $a To demonstrate product reliability under aging, an analysis of surface mounted solder joints due to thermal fatigue is included in the dissertation. This analysis was done by first examining published life test data and then identifying the intermetallic compound (IMC) thickness randomness. Results indicate that the IMC layer thickness randomness may have significant influence on the Mean Time To Failure (MTTF) and the reliability at high thermal cycles.
520 $a Finally, an improved strength-stress interference (SSI) reliability model is derived for analyzing a more general engineering degradation problem. This model incorporates both stochastic strength aging degradation and the stochastic loading force directed at the product. Statistical inference for simple stochastic processes and numerical examples are analyzed and discussed to verify the model
590 $a School code: 0009
650 $a Engineering, Industrial $3 1260336
690 $a 054
710 2 $a The University of Arizona $3 1260410
773 0 $t Dissertation Abstracts International $g 63-04B
790 $a 000
790 1 $a Dietrich, Duane L., $e adviso
791 $a Ph.D
792 $a 200
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3050366