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Mechanical characterization of thin ...

Wu, Jianxin.

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Mechanical characterization of thin film structures using a laser spallation technique.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Mechanical characterization of thin film structures using a laser spallation technique./
Author:	Wu, Jianxin.
Description:	137 p.
Notes:	Chair: Vijay Gupta.
Contained By:	Dissertation Abstracts International60-09B.
Subject:	Applied Mechanics. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9947085
ISBN:	0599492465

Mechanical characterization of thin film structures using a laser spallation technique.
Wu, Jianxin.

Mechanical characterization of thin film structures using a laser spallation technique. - 137 p.

Chair: Vijay Gupta.

Thesis (Ph.D.)--University of California, Los Angeles, 1999.

The laser spallation technique has been developed to measure the interface strength between different materials, especially thin film structures. In this work, it is refined and applied to various material systems. With these advances, the laser spallation technique is now fully mature for applications not only to measurement of material interface strength, but also to the study of laser-material interaction, dynamic fracture mechanics, as well as to the measurement of material bulk properties.

ISBN: 0599492465Subjects--Topical Terms:

1018410
Applied Mechanics.

Mechanical characterization of thin film structures using a laser spallation technique.
LDR:03789nam 2200337 a 45 001 928343
005 20110426
008 110426s1999 eng d
020 $a 0599492465
035 $a (UnM)AAI9947085
035 $a AAI9947085
040 $a UnM $c UnM
100 1 $a Wu, Jianxin. $3 1251804
245 1 0 $a Mechanical characterization of thin film structures using a laser spallation technique.
300 $a 137 p.
500 $a Chair: Vijay Gupta.
500 $a Source: Dissertation Abstracts International, Volume: 60-09, Section: B, page: 4856.
502 $a Thesis (Ph.D.)--University of California, Los Angeles, 1999.
520 $a The laser spallation technique has been developed to measure the interface strength between different materials, especially thin film structures. In this work, it is refined and applied to various material systems. With these advances, the laser spallation technique is now fully mature for applications not only to measurement of material interface strength, but also to the study of laser-material interaction, dynamic fracture mechanics, as well as to the measurement of material bulk properties.
520 $a In the first part of this work, the laser spallation technique was examined quantitatively for signal processing and stress wavefield recovery. It is shown that the short time Fourier transformation is another appropriate means for recovering the free surface displacement from the acquired optical signal. Two methods have been chosen to recover the stress field inside the sample. When the displacement of the coating's free surface is recorded directly, it is convenient to use a special finite difference strategy. When the free surface displacement is recorded on the bare substrate surface, it is more convenient to use the finite element method to calculate the interface strength.
520 $a The application work includes several topics. The first one was the evaluation of the effect of substrate orientation and deposition mode on the interface strength of Nb-sapphire interfaces. The interface strength is higher for the sapphire substrate with prismatic orientation, and RF deposition mode yields higher interface strength than the DC mode. The second application estimated the effect of substrate roughness on the interface strength of Nb-alumina system. The effect of chemical composition of thin films on the interface strength was also investigated.
520 $a The final application investigated the dynamic fracture mechanics of thin film structures. The purpose of this chapter is to clarify the controversial topic regarding the limit speed of bimaterial interface crack propagation. We were successful in using the microlithography technique to generate microcracks with controlled geometries between a thin film and its underlying substrate. The sample was mechanically loaded by using a laser generated stress pulse as discussed above. The crack propagation was monitored <italic>via</italic> a fast response circuit involving micro-wires on top of the cracked sample. The interface crack was observed to propagate at a speed close to the higher Rayleigh wave speed.
520 $a Thus, all the necessary quantification techniques have been developed for the laser spallation technique. The application to the measurement of interface strength and dynamic fracture in thin film structures showed that this is a reliable, powerful, and unique technique that has opened up new fields for experimental and theoretical research.
590 $a School code: 0031.
650 4 $a Applied Mechanics. $3 1018410
650 4 $a Engineering, Materials Science. $3 1017759
650 4 $a Engineering, Mechanical. $3 783786
690 $a 0346
690 $a 0548
690 $a 0794
710 2 0 $a University of California, Los Angeles. $3 626622
773 0 $t Dissertation Abstracts International $g 60-09B.
790 $a 0031
790 1 0 $a Gupta, Vijay, $e advisor
791 $a Ph.D.
792 $a 1999
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9947085