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Determining residual stresses in thi...
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Fang, Weileun.
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Determining residual stresses in thin film materials by using micromachined structures.
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Determining residual stresses in thin film materials by using micromachined structures./
Author:
Fang, Weileun.
Description:
114 p.
Notes:
Source: Dissertation Abstracts International, Volume: 56-05, Section: B, page: 2820.
Contained By:
Dissertation Abstracts International56-05B.
Subject:
Applied Mechanics. -
Online resource:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9530430
Determining residual stresses in thin film materials by using micromachined structures.
Fang, Weileun.
Determining residual stresses in thin film materials by using micromachined structures.
- 114 p.
Source: Dissertation Abstracts International, Volume: 56-05, Section: B, page: 2820.
Thesis (Ph.D.)--Carnegie Mellon University, 1995.
Characterization of residual stresses in thin film materials is necessary in order to improve the reliability of microelectronic, -magnetic, -optic, and -mechanical devices. In this thesis, three techniques--based on post-buckling, cantilever, and bi-layer micromachined beams--are developed to study these stresses theoretically and experimentally. In each method, static deformation of micromachined structures following relief of the in-plane stress is measured by using three-dimensional optical profilometry. In turn, the residual stress is determined by calibrating appropriate stress-deflection models to the measurements.Subjects--Topical Terms:
1018410
Applied Mechanics.
Determining residual stresses in thin film materials by using micromachined structures.
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Determining residual stresses in thin film materials by using micromachined structures.
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114 p.
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Source: Dissertation Abstracts International, Volume: 56-05, Section: B, page: 2820.
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Thesis (Ph.D.)--Carnegie Mellon University, 1995.
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Characterization of residual stresses in thin film materials is necessary in order to improve the reliability of microelectronic, -magnetic, -optic, and -mechanical devices. In this thesis, three techniques--based on post-buckling, cantilever, and bi-layer micromachined beams--are developed to study these stresses theoretically and experimentally. In each method, static deformation of micromachined structures following relief of the in-plane stress is measured by using three-dimensional optical profilometry. In turn, the residual stress is determined by calibrating appropriate stress-deflection models to the measurements.
520
$a
In the post-buckling and cantilever techniques, the diagnostic structures are fabricated from the thin film for which the residual stresses are desired. In the bi-layer technique, on the other hand, the thin film material is deposited onto an existing "base layer" micromachined cantilever; this strategy provides improved measurement sensitivity, even for very thin films. In several case studies, the methods are applied to characterize the residual stresses in silicon dioxide, an aluminum-copper alloy, and diamond-like carbon.
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The fundamental contributions of the thesis are four-fold: (1) an objective criterion for determining mean compressive stress by evaluating the post-buckled behavior of micromachined beams, (2) identification and evaluation of the "boundary rotation" phenomenon in micromachined structures, (3) simultaneous measurement of mean tensile/compressive and gradient stresses, and (4) a robust technique for determining stresses in very thin materials.
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School code: 0041.
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1995
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http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9530430
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