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Determining residual stresses in thi...

Fang, Weileun.

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Determining residual stresses in thin film materials by using micromachined structures.

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	Determining residual stresses in thin film materials by using micromachined structures./
作者:	Fang, Weileun.
面頁冊數:	114 p.
附註:	Source: Dissertation Abstracts International, Volume: 56-05, Section: B, page: 2820.
Contained By:	Dissertation Abstracts International56-05B.
標題:	Applied Mechanics. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9530430

Determining residual stresses in thin film materials by using micromachined structures.
Fang, Weileun.

Determining residual stresses in thin film materials by using micromachined structures. - 114 p.

Source: Dissertation Abstracts International, Volume: 56-05, Section: B, page: 2820.

Thesis (Ph.D.)--Carnegie Mellon University, 1995.

Characterization of residual stresses in thin film materials is necessary in order to improve the reliability of microelectronic, -magnetic, -optic, and -mechanical devices. In this thesis, three techniques--based on post-buckling, cantilever, and bi-layer micromachined beams--are developed to study these stresses theoretically and experimentally. In each method, static deformation of micromachined structures following relief of the in-plane stress is measured by using three-dimensional optical profilometry. In turn, the residual stress is determined by calibrating appropriate stress-deflection models to the measurements.Subjects--Topical Terms:

1018410
Applied Mechanics.

Determining residual stresses in thin film materials by using micromachined structures.
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008 110426s1995 eng d
035 $a (UnM)AAI9530430
035 $a AAI9530430
040 $a UnM $c UnM
100 1 $a Fang, Weileun. $3 1251791
245 1 0 $a Determining residual stresses in thin film materials by using micromachined structures.
300 $a 114 p.
500 $a Source: Dissertation Abstracts International, Volume: 56-05, Section: B, page: 2820.
502 $a Thesis (Ph.D.)--Carnegie Mellon University, 1995.
520 $a Characterization of residual stresses in thin film materials is necessary in order to improve the reliability of microelectronic, -magnetic, -optic, and -mechanical devices. In this thesis, three techniques--based on post-buckling, cantilever, and bi-layer micromachined beams--are developed to study these stresses theoretically and experimentally. In each method, static deformation of micromachined structures following relief of the in-plane stress is measured by using three-dimensional optical profilometry. In turn, the residual stress is determined by calibrating appropriate stress-deflection models to the measurements.
520 $a In the post-buckling and cantilever techniques, the diagnostic structures are fabricated from the thin film for which the residual stresses are desired. In the bi-layer technique, on the other hand, the thin film material is deposited onto an existing "base layer" micromachined cantilever; this strategy provides improved measurement sensitivity, even for very thin films. In several case studies, the methods are applied to characterize the residual stresses in silicon dioxide, an aluminum-copper alloy, and diamond-like carbon.
520 $a The fundamental contributions of the thesis are four-fold: (1) an objective criterion for determining mean compressive stress by evaluating the post-buckled behavior of micromachined beams, (2) identification and evaluation of the "boundary rotation" phenomenon in micromachined structures, (3) simultaneous measurement of mean tensile/compressive and gradient stresses, and (4) a robust technique for determining stresses in very thin materials.
590 $a School code: 0041.
650 4 $a Applied Mechanics. $3 1018410
650 4 $a Engineering, Mechanical. $3 783786
690 $a 0346
690 $a 0548
710 2 0 $a Carnegie Mellon University. $3 1018096
773 0 $t Dissertation Abstracts International $g 56-05B.
790 $a 0041
791 $a Ph.D.
792 $a 1995
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9530430