Assembly, cross-linking and encapsul...
University of Massachusetts Amherst., Polymer Science & Engineering.

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  • Assembly, cross-linking and encapsulation using functionalized nanoparticles at liquid interfaces.
  • 紀錄類型: 書目-電子資源 : Monograph/item
    正題名/作者: Assembly, cross-linking and encapsulation using functionalized nanoparticles at liquid interfaces./
    作者: Tangirala, Ravisubhash.
    面頁冊數: 176 p.
    附註: Advisers: Todd Emrick; Thomas P. Russell.
    Contained By: Dissertation Abstracts International70-03B.
    標題: Chemistry, Polymer. -
    電子資源: http://pqdd.sinica.edu.tw/twdaoeng/servlet/advanced?query=3349705
    ISBN: 9781109059113
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