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Carbon nanotube thermal interface ma...

Hong Kong University of Science and Technology (Hong Kong)., HKUST.

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Carbon nanotube thermal interface material and its application in high brightness LED packages.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Carbon nanotube thermal interface material and its application in high brightness LED packages./
Author:	Zhang, Kai.
Description:	173 p.
Notes:	Adviser: Matthew M. F. Yuen.
Contained By:	Dissertation Abstracts International70-03B.
Subject:	Engineering, Mechanical. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3349541
ISBN:	9781109054286

Carbon nanotube thermal interface material and its application in high brightness LED packages.
Zhang, Kai.

Carbon nanotube thermal interface material and its application in high brightness LED packages. - 173 p.

Adviser: Matthew M. F. Yuen.

Thesis (Ph.D.)--Hong Kong University of Science and Technology (Hong Kong), 2008.

Microelectronic packages and high brightness light emitting diode (HB-LED) packages face a common thermal challenge in high power density applications. The high thermal resistance of conventional thermal interface materials (TIM) continues to be a key issue of the heat dissipation in high power packages. Carbon nanotube (CNT) is a promising substitute for the polymer based TIM. In this thesis, several kinds of CNT-TIMs are developed and optimized. Their thermal performances are characterized according to the American Society for Testing and Materials (ASTM) D5470 standard and are evaluated in HB-LED packages.

ISBN: 9781109054286Subjects--Topical Terms:

783786
Engineering, Mechanical.

Carbon nanotube thermal interface material and its application in high brightness LED packages.
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020 $a 9781109054286
035 $a (UMI)AAI3349541
035 $a AAI3349541
040 $a UMI $c UMI
100 1 $a Zhang, Kai. $3 1034107
245 1 0 $a Carbon nanotube thermal interface material and its application in high brightness LED packages.
300 $a 173 p.
500 $a Adviser: Matthew M. F. Yuen.
500 $a Source: Dissertation Abstracts International, Volume: 70-03, Section: B, page: 1917.
502 $a Thesis (Ph.D.)--Hong Kong University of Science and Technology (Hong Kong), 2008.
520 $a Microelectronic packages and high brightness light emitting diode (HB-LED) packages face a common thermal challenge in high power density applications. The high thermal resistance of conventional thermal interface materials (TIM) continues to be a key issue of the heat dissipation in high power packages. Carbon nanotube (CNT) is a promising substitute for the polymer based TIM. In this thesis, several kinds of CNT-TIMs are developed and optimized. Their thermal performances are characterized according to the American Society for Testing and Materials (ASTM) D5470 standard and are evaluated in HB-LED packages.
520 $a A theoretical understanding of the phonon heat transfer mechanism in CNTs is essential for CNT-TIM design and optimization. The factors influencing the thermal conductivity of CNTs are studied to find out the directions of improving the thermal performance of CNT-TIMs.
520 $a Two possible kinds of CNT based TIMs, CNT-composite-TIM and vertically aligned CNT-TIM (VACNT-TIM), are prepared and their thermal performances are compared. The subsequent research work focuses on developing desired VACNT-TIMs because the thermal performance of CNT-composite-TIM fails to meet the thermal management requirement in high power packages.
520 $a A CNT synthesis method is presented to fabricate VACNT-TIM with desired diameters. The effect of the CNT diameter on the thermal performance of TIM is studied. Plasma enhanced chemical vapor deposition (PECVD) is adopted to fabricate VACNT-TIM with high quality. The thermal performance of VACNT-TIM grown with PECVD is proved to be higher than that of VACNT-TIM fabricated with thermal CVD. A methodology to synthesize well aligned VACNT-TIM with high density on aluminum alloy heatsinks is developed for practical applications at low cost.
520 $a In order to evaluate the effect of VACNT-TIM on the thermal and brightness performance of HB-LED devices, a novel packaging process is proposed. Some of the developed CNT-TIMs are applied in HB-LED packages and their output light power is measured. It is demonstrated that the VANCT-TIM helps to improve the brightness performance of the HB-LED packages.
590 $a School code: 1223.
650 4 $a Engineering, Mechanical. $3 783786
690 $a 0548
710 2 $a Hong Kong University of Science and Technology (Hong Kong). $b HKUST. $3 1020712
773 0 $t Dissertation Abstracts International $g 70-03B.
790 $a 1223
790 1 0 $a Yuen, Matthew M. F., $e advisor
791 $a Ph.D.
792 $a 2008
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3349541