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Materials for Information Technology...

Mikolajick, Thomas.

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Materials for Information Technology = Devices, Interconnects and Packaging /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Materials for Information Technology/ edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick.
Reminder of title:	Devices, Interconnects and Packaging /
other author:	Mikolajick, Thomas.
corporate name:	Euromat 2003
Published:	London :Springer-Verlag London Limited, : 2005.,
Description:	xix, 508 p. :ill., digital ;24 cm.
Series:	Engineering Materials and Processes,
Contained By:	Springer e-books
Subject:	Information technology - Congresses. -
Online resource:	http://dx.doi.org/10.1007/1-84628-235-7http://dx.doi.org/10.1007/1-84628-235-7
ISBN:	9781846282355 (electronic bk.)

Materials for Information Technology = Devices, Interconnects and Packaging /
Materials for Information TechnologyDevices, Interconnects and Packaging /[electronic resource] :edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick. - London :Springer-Verlag London Limited,2005. - xix, 508 p. :ill., digital ;24 cm. - Engineering Materials and Processes,1619-0181.

ISBN: 9781846282355 (electronic bk.)Subjects--Topical Terms:

543170
Information technology
--Congresses.

LC Class. No.: TK7874 / .E75 2003

Dewey Class. No.: 621.381

Materials for Information Technology = Devices, Interconnects and Packaging /
LDR:00907nam a2200241 a 45 001 766162
003 Springer
005 20080716
006 m d
007 cr nn 008maaau
008 080716s2005 enk j eng d
020 $a 9781846282355 (electronic bk.)
020 $a 9781852339418 (paper)
035 $a 978-1-85233-941-8
040 $a NDHU $c NDHU $d NDHU
050 0 0 $a TK7874 $b .E75 2003
082 0 0 $a 621.381 $2 22
111 $a Euromat 2003 $d (2003 : $c Lausanne, Switzerland) $3 896737
245 1 0 $a Materials for Information Technology $h [electronic resource] : $b Devices, Interconnects and Packaging / $c edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick.
260 $a London : $c 2005. $b Springer-Verlag London Limited,
300 $a xix, 508 p. : $b ill., digital ; $c 24 cm.
440 0 $a Engineering Materials and Processes, $x 1619-0181
650 $a Information technology $v Congresses. $3 543170
650 $a Microelectronics $x Materials $x Congresses. $3 669447
650 $a Engineering. $3 586835
650 $a Ceramics, Glass, Composites, Natural Methods. $3 894123
650 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 $a Metallic Materials. $3 893995
650 $a Physics and Applied Physics in Engineering. $3 892406
650 $a Solid State Physics and Spectroscopy. $3 894024
650 $a Surfaces and Interfaces, Thin Films. $3 892408
700 $a Mikolajick, Thomas. $3 896734
700 $a Whelan, Caroline. $3 896735
700 $a Zschech, Ehrenfried. $3 896736
710 $a SpringerLink (Online service) $3 836513
773 0 $t Springer e-books
856 4 0 $u http://dx.doi.org/10.1007/1-84628-235-7 $z http://dx.doi.org/10.1007/1-84628-235-7
950 $a Engineering (Springer-11647; ZDB-2-ENG)