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Electronic materials innovations and reliability in advanced memory packaging

Record Type:	Electronic resources : Monograph/item
Title/Author:	Electronic materials innovations and reliability in advanced memory packaging/ by Chong Leong Gan, Chen Yu Huang.
Author:	Gan, Chong Leong.
other author:	Huang, Chen-Yu.
Published:	Cham :Springer Nature Switzerland : : 2025.,
Description:	xv, 178 p. :ill. (some col.), digital ;24 cm.
[NT 15003449]:	Influences of Electronic Materials Properties on Packaging Reliability -- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging -- Materials Development for Future Data Center Applications -- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging -- Hybrid Bonding Device Packaging -- Hardware Reliability for Memory Modules and SSDs -- Innovative Sustainable Electronics Materials in Advanced Memory Packaging -- PCB and Substrate in Future Memory Applications.
Contained By:	Springer Nature eBook
Subject:	Electronic packaging - Materials. -
Online resource:	https://doi.org/10.1007/978-3-031-94795-7
ISBN:	9783031947957

Electronic materials innovations and reliability in advanced memory packaging
Gan, Chong Leong.

Electronic materials innovations and reliability in advanced memory packaging[electronic resource] /by Chong Leong Gan, Chen Yu Huang. - Cham :Springer Nature Switzerland :2025. - xv, 178 p. :ill. (some col.), digital ;24 cm. - Springer series in reliability engineering,2196-999X. - Springer series in reliability engineering..

Influences of Electronic Materials Properties on Packaging Reliability -- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging -- Materials Development for Future Data Center Applications -- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging -- Hybrid Bonding Device Packaging -- Hardware Reliability for Memory Modules and SSDs -- Innovative Sustainable Electronics Materials in Advanced Memory Packaging -- PCB and Substrate in Future Memory Applications.

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.

ISBN: 9783031947957

Standard No.: 10.1007/978-3-031-94795-7doiSubjects--Topical Terms:

669442
Electronic packaging
--Materials.

LC Class. No.: TK7870.15

Dewey Class. No.: 621.381046

Electronic materials innovations and reliability in advanced memory packaging
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505 0 $a Influences of Electronic Materials Properties on Packaging Reliability -- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging -- Materials Development for Future Data Center Applications -- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging -- Hybrid Bonding Device Packaging -- Hardware Reliability for Memory Modules and SSDs -- Innovative Sustainable Electronics Materials in Advanced Memory Packaging -- PCB and Substrate in Future Memory Applications.
520 $a This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
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650 2 4 $a Materials Engineering. $3 2071625
650 2 4 $a Industrial and Production Engineering. $3 891024
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