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A Study on Thermal and Moisture Impa...

Wang, Jing.

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A Study on Thermal and Moisture Impacts on Reliability of Electronic Packaging.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	A Study on Thermal and Moisture Impacts on Reliability of Electronic Packaging./
作者:	Wang, Jing.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2018,
面頁冊數:	138 p.
附註:	Source: Dissertations Abstracts International, Volume: 79-11, Section: B.
Contained By:	Dissertations Abstracts International79-11B.
標題:	Mechanical engineering. -
電子資源:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=10812345
ISBN:	9780355929010

A Study on Thermal and Moisture Impacts on Reliability of Electronic Packaging.
Wang, Jing.

A Study on Thermal and Moisture Impacts on Reliability of Electronic Packaging. - Ann Arbor : ProQuest Dissertations & Theses, 2018 - 138 p.

Source: Dissertations Abstracts International, Volume: 79-11, Section: B.

Thesis (Ph.D.)--State University of New York at Binghamton, 2018.

.

Heat and moisture are the two enemies of electronic devices because they have detrimental effects on the reliability and integrity of electronic packaging. Although the physics behind thermal diffusion and moisture diffusion are analogous, they behave differently in affecting the reliability of electronic packages. In this research, both thermal and moisture impacts on the reliability of electronic packages were investigated. The first half of this research addressed the moisture related reliability issues in electronic packages considering both moisture diffusion and moisture induced delamination. Different approaches that can deal with the moisture diffusion under dynamic thermal loading conditions were reviewed and compared by case studies. Advantages and disadvantages of each approach were analyzed and discussed. Theoretical derivation was developed to prove the direct concentration approach was fundamentally flawed. The internal source approach was shown to be a universal method in modeling the moisture diffusion in a multi-material system under dynamic thermal loading conditions. After that, the moisture induced delamination behavior of a stacked die package under the solder reflow process was investigated by finite element analysis. The entire moisture history of the stacked die package was simulated for preconditioning at moisture sensitivity level 1 and the subsequent exposure to a lead-free solder reflow using the internal source approach. A novel method was proposed and utilized to investigate the combined effects of temperature, moisture and vapor pressure on the delamination behavior at the die/molding compound and die/die attach interfaces during solder reflow based on linear elastic fracture mechanics. Virtual crack closure technique (VCCT) was employed in studying the variation of strain energy release rates during lead-free solder reflow. The relationship between the strain energy release rate and crack length was also obtained. The developments of the strain energy release rate due to individual effect of thermal mismatch, hygroscopic swelling and vapor pressure were calculated. The second half of this research investigated the reliability of 2.5D package based on both thermal performance and thermo-mechanical reliability. The main purpose was to provide design guidelines for building thermo-mechanically reliable 2.5D packages. A three-dimensional finite element model of a lidless 2.5D package was analyzed under different design parameters. Finite element analyses were performed to compare the package warpage and die stress among different material selections and geometric designs. Moreover, the solder joint reliability were analyzed on the board level model considering important design factors obtained from package level analysis. Optimal design factors were achieved through both package level analysis and board level analysis. It was found that several design factors show totally different trends in affecting package level and board level reliability. Experiment was performed to investigate the thermal performance of a lidded 2.5D package thermal test vehicle under both steady state and power cycling conditions. The temperature map of silicon chips was obtained under different test conditions. The influence of clamping pressure, TIM type, wind velocity, applied power and lid coverage on the junction to case and the junction to ambient thermal resistance was explored. It was found that the lidless design was an effective way in reducing the junction temperature and junction to ambient thermal resistance.

ISBN: 9780355929010Subjects--Topical Terms:

649730
Mechanical engineering.
Subjects--Index Terms:

2.5D package

A Study on Thermal and Moisture Impacts on Reliability of Electronic Packaging.
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300 $a 138 p.
500 $a Source: Dissertations Abstracts International, Volume: 79-11, Section: B.
500 $a Publisher info.: Dissertation/Thesis.
500 $a Advisor: Park, Seungbae.
502 $a Thesis (Ph.D.)--State University of New York at Binghamton, 2018.
506 $a .
520 $a Heat and moisture are the two enemies of electronic devices because they have detrimental effects on the reliability and integrity of electronic packaging. Although the physics behind thermal diffusion and moisture diffusion are analogous, they behave differently in affecting the reliability of electronic packages. In this research, both thermal and moisture impacts on the reliability of electronic packages were investigated. The first half of this research addressed the moisture related reliability issues in electronic packages considering both moisture diffusion and moisture induced delamination. Different approaches that can deal with the moisture diffusion under dynamic thermal loading conditions were reviewed and compared by case studies. Advantages and disadvantages of each approach were analyzed and discussed. Theoretical derivation was developed to prove the direct concentration approach was fundamentally flawed. The internal source approach was shown to be a universal method in modeling the moisture diffusion in a multi-material system under dynamic thermal loading conditions. After that, the moisture induced delamination behavior of a stacked die package under the solder reflow process was investigated by finite element analysis. The entire moisture history of the stacked die package was simulated for preconditioning at moisture sensitivity level 1 and the subsequent exposure to a lead-free solder reflow using the internal source approach. A novel method was proposed and utilized to investigate the combined effects of temperature, moisture and vapor pressure on the delamination behavior at the die/molding compound and die/die attach interfaces during solder reflow based on linear elastic fracture mechanics. Virtual crack closure technique (VCCT) was employed in studying the variation of strain energy release rates during lead-free solder reflow. The relationship between the strain energy release rate and crack length was also obtained. The developments of the strain energy release rate due to individual effect of thermal mismatch, hygroscopic swelling and vapor pressure were calculated. The second half of this research investigated the reliability of 2.5D package based on both thermal performance and thermo-mechanical reliability. The main purpose was to provide design guidelines for building thermo-mechanically reliable 2.5D packages. A three-dimensional finite element model of a lidless 2.5D package was analyzed under different design parameters. Finite element analyses were performed to compare the package warpage and die stress among different material selections and geometric designs. Moreover, the solder joint reliability were analyzed on the board level model considering important design factors obtained from package level analysis. Optimal design factors were achieved through both package level analysis and board level analysis. It was found that several design factors show totally different trends in affecting package level and board level reliability. Experiment was performed to investigate the thermal performance of a lidded 2.5D package thermal test vehicle under both steady state and power cycling conditions. The temperature map of silicon chips was obtained under different test conditions. The influence of clamping pressure, TIM type, wind velocity, applied power and lid coverage on the junction to case and the junction to ambient thermal resistance was explored. It was found that the lidless design was an effective way in reducing the junction temperature and junction to ambient thermal resistance.
590 $a School code: 0792.
650 4 $a Mechanical engineering. $3 649730
650 4 $a Packaging. $3 585030
653 $a 2.5D package
653 $a Delamination
653 $a Electronic packaging
653 $a Moisture
653 $a Solder reliability
653 $a Thermal characterization
690 $a 0548
690 $a 0549
710 2 $a State University of New York at Binghamton. $b Mechanical Engineering. $3 1035655
773 0 $t Dissertations Abstracts International $g 79-11B.
790 $a 0792
791 $a Ph.D.
792 $a 2018
793 $a English
856 4 0 $u https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=10812345