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Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction./
Author:	Chau, Hung.
Description:	1 online resource (36 pages)
Notes:	Source: Masters Abstracts International, Volume: 72-06.
Contained By:	Masters Abstracts International72-06.
Subject:	Electrical engineering. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1482803click for full text (PQDT)
ISBN:	9781124315553

Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction.
Chau, Hung.

Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction. - 1 online resource (36 pages)

Source: Masters Abstracts International, Volume: 72-06.

Thesis (M.S.)--University of California, Irvine, 2010.

Includes bibliographical references

Thermal resistance of a Quad Flat Nolead (QFN) package, comprised of the bulk material resistance of a die attach with its two interfaces, is measured by thermal transient technique. Two die attach chemistries (Ag filled and Boron Nitride filled) and three die-backside coatings (TiNiAg, Au, and bare Si) were investigated to understand their contribution to the thermal resistance. Of the tests conducted, the most effective combination was a metalized layer of TiNiAg with the Ag filled epoxy system. In order to further improve the thermal resistance reduction, electron to phonon and phonon to phonon transport must be better understood.

Electronic reproduction.
Ann Arbor, Mich. :
ProQuest,
2023

Mode of access: World Wide Web

ISBN: 9781124315553Subjects--Topical Terms:

649834
Electrical engineering.
Subjects--Index Terms:

Backside metalizationIndex Terms--Genre/Form:

542853
Electronic books.

Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction.
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008 241011s2010 xx obm 000 0 eng d
020 $a 9781124315553
035 $a (MiAaPQ)AAI1482803
035 $a (MiAaPQ)uci:10631
035 $a AAI1482803
040 $a MiAaPQ $b eng $c MiAaPQ $d NTU
100 1 $a Chau, Hung. $3 3700769
245 1 0 $a Titanium nickel silver and gold die backside metalization for Quad Flat Nolead package thermal resistance reduction.
264 0 $c 2010
300 $a 1 online resource (36 pages)
336 $a text $b txt $2 rdacontent
337 $a computer $b c $2 rdamedia
338 $a online resource $b cr $2 rdacarrier
500 $a Source: Masters Abstracts International, Volume: 72-06.
500 $a Publisher info.: Dissertation/Thesis.
500 $a Advisor: Shi, Frank G.
502 $a Thesis (M.S.)--University of California, Irvine, 2010.
504 $a Includes bibliographical references
520 $a Thermal resistance of a Quad Flat Nolead (QFN) package, comprised of the bulk material resistance of a die attach with its two interfaces, is measured by thermal transient technique. Two die attach chemistries (Ag filled and Boron Nitride filled) and three die-backside coatings (TiNiAg, Au, and bare Si) were investigated to understand their contribution to the thermal resistance. Of the tests conducted, the most effective combination was a metalized layer of TiNiAg with the Ag filled epoxy system. In order to further improve the thermal resistance reduction, electron to phonon and phonon to phonon transport must be better understood.
533 $a Electronic reproduction. $b Ann Arbor, Mich. : $c ProQuest, $d 2023
538 $a Mode of access: World Wide Web
650 4 $a Electrical engineering. $3 649834
650 4 $a Packaging. $3 585030
650 4 $a Materials science. $3 543314
653 $a Backside metalization
653 $a Interfacial thermal resistance
653 $a Phonon
653 $a Qfn
653 $a Thermal resistance
653 $a Transient thermal test
655 7 $a Electronic books. $2 lcsh $3 542853
690 $a 0544
690 $a 0549
690 $a 0794
710 2 $a ProQuest Information and Learning Co. $3 783688
710 2 $a University of California, Irvine. $b Engineering - M.S.. $3 3426346
773 0 $t Masters Abstracts International $g 72-06.
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1482803 $z click for full text (PQDT)