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Integrated flip -chip flex -circuit packaging for power electronics applications.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Integrated flip -chip flex -circuit packaging for power electronics applications./
作者:	Xiao, Ying.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2003,
面頁冊數:	225 p.
附註:	Source: Dissertations Abstracts International, Volume: 65-06, Section: B.
Contained By:	Dissertations Abstracts International65-06B.
標題:	Electrical engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3098892
ISBN:	9780496464968

Integrated flip -chip flex -circuit packaging for power electronics applications.
Xiao, Ying.

Integrated flip -chip flex -circuit packaging for power electronics applications. - Ann Arbor : ProQuest Dissertations & Theses, 2003 - 225 p.

Source: Dissertations Abstracts International, Volume: 65-06, Section: B.

Thesis (Ph.D.)--Rensselaer Polytechnic Institute, 2003.

This item must not be sold to any third party vendors.

Interests in developing novel packaging technologies for integrated power electronic modules (IPEMs) have been triggered by a demand to increase efficiency, improve reliability, reduce size and lower cost of power electronic systems. In this research an innovative packaging platform has been developed, which extends the well-established flex-circuit and flip-chip soldering technologies in signal electronics to power electronics applications. The generic platform incorporates flex-circuit and direct bond copper (DBC) as interconnections for power dies embedded between the flex and DBC, with control circuit integrated on top of the flex-circuit. Electrical design and evaluation have been emphasized to evaluate the potential of the packaging platform. Analytical models are developed to analyze the impact of the packaging partial inductances on the switching characteristics of a MOSFET inverter. Two types of flip-chip flex-circuit half-bridge test vehicles have been designed and fabricated; one with MOSFETs and Schottky diodes for 42V/15A automotive applications and the other with IGBTs and P-i-N diodes for 400V/10A motor-drive applications. The test vehicles demonstrate over 50% lower packaging size comparing to a discrete package implementation. The successful operation of both test vehicles at double-pulse and high duty-ratio condition demonstrates the feasibility of the flip-chip flex-circuit packaging platform over a wide range of low-to-medium power applications. A key attribute of the power-flex platform is the reduced parasitic inductance. Experimental results demonstrate approximately 40% lower voltage overshoot and up to 24% lower turn-off loss for the 42V MOSFET test vehicle compared to the discrete implementation. The greatly reduced voltage overshoot in a flex-circuit package allows the use of MOSFETs with lower breakdown voltage and inherently lower device conduction resistance; as a result the total power loss of less than 40% of the higher voltage MOSFET implementation is predicted. For 400V IGBT half-bridge test vehicles, the lowest power loss is achieved with fast-switching IGBT devices. The low packaging inductance ensures voltage overshoot not to exceed the IGBT safe operating area (SOA). A flip-chip flex-circuit platform in combination with optimized switching devices and compatible drive circuits can achieve reduced power loss, packaging size, and manufacturing cost.

ISBN: 9780496464968Subjects--Topical Terms:

649834
Electrical engineering.
Subjects--Index Terms:

Flex-circuit

Integrated flip -chip flex -circuit packaging for power electronics applications.
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520 $a Interests in developing novel packaging technologies for integrated power electronic modules (IPEMs) have been triggered by a demand to increase efficiency, improve reliability, reduce size and lower cost of power electronic systems. In this research an innovative packaging platform has been developed, which extends the well-established flex-circuit and flip-chip soldering technologies in signal electronics to power electronics applications. The generic platform incorporates flex-circuit and direct bond copper (DBC) as interconnections for power dies embedded between the flex and DBC, with control circuit integrated on top of the flex-circuit. Electrical design and evaluation have been emphasized to evaluate the potential of the packaging platform. Analytical models are developed to analyze the impact of the packaging partial inductances on the switching characteristics of a MOSFET inverter. Two types of flip-chip flex-circuit half-bridge test vehicles have been designed and fabricated; one with MOSFETs and Schottky diodes for 42V/15A automotive applications and the other with IGBTs and P-i-N diodes for 400V/10A motor-drive applications. The test vehicles demonstrate over 50% lower packaging size comparing to a discrete package implementation. The successful operation of both test vehicles at double-pulse and high duty-ratio condition demonstrates the feasibility of the flip-chip flex-circuit packaging platform over a wide range of low-to-medium power applications. A key attribute of the power-flex platform is the reduced parasitic inductance. Experimental results demonstrate approximately 40% lower voltage overshoot and up to 24% lower turn-off loss for the 42V MOSFET test vehicle compared to the discrete implementation. The greatly reduced voltage overshoot in a flex-circuit package allows the use of MOSFETs with lower breakdown voltage and inherently lower device conduction resistance; as a result the total power loss of less than 40% of the higher voltage MOSFET implementation is predicted. For 400V IGBT half-bridge test vehicles, the lowest power loss is achieved with fast-switching IGBT devices. The low packaging inductance ensures voltage overshoot not to exceed the IGBT safe operating area (SOA). A flip-chip flex-circuit platform in combination with optimized switching devices and compatible drive circuits can achieve reduced power loss, packaging size, and manufacturing cost.
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