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Wire bonding in microelectronics
~
Harman, George G.
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Wire bonding in microelectronics
Record Type:
Electronic resources : Monograph/item
Title/Author:
Wire bonding in microelectronics/ George G. Harmon.
Author:
Harman, George G.
other author:
Harman, George G.
Published:
New York :McGraw-Hill, : c2010.,
Description:
xx, 426 p. :ill.
Subject:
Wire bonding (Electronic packaging) - Production control. -
Online resource:
https://lb30.libraryandbook.net/Book_detial/EB978007147623201Click for full text (McGrawHill)
ISBN:
9780071476232
Wire bonding in microelectronics
Harman, George G.
Wire bonding in microelectronics
[electronic resource] /George G. Harmon. - 3rd ed. - New York :McGraw-Hill,c2010. - xx, 426 p. :ill.
ISBN: 9780071476232
LCCN: 2010287045Subjects--Topical Terms:
821561
Wire bonding (Electronic packaging)
--Production control.Index Terms--Genre/Form:
542853
Electronic books.
LC Class. No.: TK7836 / .H366 2010
Dewey Class. No.: 621.381
Wire bonding in microelectronics
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https://lb30.libraryandbook.net/Book_detial/EB978007147623201
$z
Click for full text (McGrawHill)
based on 0 review(s)
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Items
1 records • Pages 1 •
1
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Attachments
W9457355
電子資源
11.線上閱覽_V
電子書
EB TK7836 .H366 2010
一般使用(Normal)
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1 records • Pages 1 •
1
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