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博客來
晶圓代工與先進封裝產業科技實務 = = Wafer foundry and advanced package industry technology /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
晶圓代工與先進封裝產業科技實務 =/ 曲建仲編著
Reminder of title:
Wafer foundry and advanced package industry technology /
remainder title:
Wafer foundry and advanced package industry technology
Author:
曲建仲
Published:
新北市 :全華圖書, : 2023[民112],
Description:
278面 :圖 ;23公分
Notes:
含索引
Subject:
工程材料 -
ISBN:
9786263284166
晶圓代工與先進封裝產業科技實務 = = Wafer foundry and advanced package industry technology /
曲建仲
晶圓代工與先進封裝產業科技實務 =
Wafer foundry and advanced package industry technology /Wafer foundry and advanced package industry technology曲建仲編著 - 初版 - 新北市 :全華圖書, 2023[民112] - 278面 :圖 ;23公分 - 跨領域科技素養教育系列課程 ;第1冊. - 跨領域科技素養教育系列課程 ;第1冊.
含索引
ISBN: 9786263284166NT$380Subjects--Topical Terms:
2075532
工程材料
晶圓代工與先進封裝產業科技實務 = = Wafer foundry and advanced package industry technology /
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3655299
based on 0 review(s)
ISSUES
壽豐校區(SF Campus)
-
last issue:
1 (2024/02/05)
Details
Location:
ALL
四樓中文書區000-599(4F Eastern Language Books)
Year:
Volume Number:
Items
1 records • Pages 1 •
1
Inventory Number
Location Name
Item Class
Material type
Call number
Usage Class
Loan Status
No. of reservations
Opac note
Attachments
E0794889
四樓中文書區000-599(4F Eastern Language Books)
01.外借(書)_YB
一般圖書
448.65 5512 2023
一般使用(Normal)
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0
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1 records • Pages 1 •
1
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