東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back

Switch To: Labeled | MARC Mode | ISBD

Advanced materials and components fo...

Tong, Xingcun Colin.

Linked to FindBook

Google Book

Amazon

博客來

Advanced materials and components for 5G and beyond

Record Type:	Electronic resources : Monograph/item
Title/Author:	Advanced materials and components for 5G and beyond/ by Colin Tong.
Author:	Tong, Xingcun Colin.
Published:	Cham :Springer Nature Switzerland : : 2022.,
Description:	xix, 261 p. :ill., digital ;24 cm.
[NT 15003449]:	Chapter 1. 5G technology components and material solutions for hardware system integration -- Chapter 2. Semiconductor solutions for 5G -- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits -- Chapter 4. PCB materials and design requirements for 5G systems -- Chapter 5. Materials for high frequency filters -- Chapter 6. EMI shielding materials and absorbers for 5G communications -- Chapter 7. Thermal management materials and components for 5G devices -- Chapter 8. Protective packaging and sealing materials for 5G mobile devices -- Chapter 9. Perspectives on 5G and beyond applications and related technologies.
Contained By:	Springer Nature eBook
Subject:	5G mobile communication systems - Equipment and supplies. -
Online resource:	https://doi.org/10.1007/978-3-031-17207-6
ISBN:	9783031172076

Advanced materials and components for 5G and beyond
Tong, Xingcun Colin.

Advanced materials and components for 5G and beyond[electronic resource] /by Colin Tong. - Cham :Springer Nature Switzerland :2022. - xix, 261 p. :ill., digital ;24 cm. - Springer series in materials science,v. 3272196-2812 ;. - Springer series in materials science ;v. 327..

Chapter 1. 5G technology components and material solutions for hardware system integration -- Chapter 2. Semiconductor solutions for 5G -- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits -- Chapter 4. PCB materials and design requirements for 5G systems -- Chapter 5. Materials for high frequency filters -- Chapter 6. EMI shielding materials and absorbers for 5G communications -- Chapter 7. Thermal management materials and components for 5G devices -- Chapter 8. Protective packaging and sealing materials for 5G mobile devices -- Chapter 9. Perspectives on 5G and beyond applications and related technologies.

This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today's students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.

ISBN: 9783031172076

Standard No.: 10.1007/978-3-031-17207-6doiSubjects--Topical Terms:

3609488
5G mobile communication systems
--Equipment and supplies.

LC Class. No.: TK5103.25

Dewey Class. No.: 621.3845

Advanced materials and components for 5G and beyond
LDR:03595nmm a2200361 a 4500 001 2305943
003 DE-He213
005 20221116174519.0
006 m d
007 cr nn 008maaau
008 230409s2022 sz s 0 eng d
020 $a 9783031172076 $q (electronic bk.)
020 $a 9783031172069 $q (paper)
024 7 $a 10.1007/978-3-031-17207-6 $2 doi
035 $a 978-3-031-17207-6
040 $a GP $c GP
041 0 $a eng
050 4 $a TK5103.25
072 7 $a PHJ $2 bicssc
072 7 $a TJK $2 bicssc
072 7 $a SCI053000 $2 bisacsh
072 7 $a PHJ $2 thema
072 7 $a TJK $2 thema
082 0 4 $a 621.3845 $2 23
090 $a TK5103.25 $b .T665 2022
100 1 $a Tong, Xingcun Colin. $3 2050009
245 1 0 $a Advanced materials and components for 5G and beyond $h [electronic resource] / $c by Colin Tong.
260 $a Cham : $b Springer Nature Switzerland : $b Imprint: Springer, $c 2022.
300 $a xix, 261 p. : $b ill., digital ; $c 24 cm.
490 1 $a Springer series in materials science, $x 2196-2812 ; $v v. 327
505 0 $a Chapter 1. 5G technology components and material solutions for hardware system integration -- Chapter 2. Semiconductor solutions for 5G -- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits -- Chapter 4. PCB materials and design requirements for 5G systems -- Chapter 5. Materials for high frequency filters -- Chapter 6. EMI shielding materials and absorbers for 5G communications -- Chapter 7. Thermal management materials and components for 5G devices -- Chapter 8. Protective packaging and sealing materials for 5G mobile devices -- Chapter 9. Perspectives on 5G and beyond applications and related technologies.
520 $a This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today's students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.
650 0 $a 5G mobile communication systems $x Equipment and supplies. $3 3609488
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer Nature eBook
830 0 $a Springer series in materials science ; $v v. 327. $3 3609487
856 4 0 $u https://doi.org/10.1007/978-3-031-17207-6
950 $a Physics and Astronomy (SpringerNature-11651)