Advanced materials and components fo...
Tong, Xingcun Colin.

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  • Advanced materials and components for 5G and beyond
  • 紀錄類型: 書目-電子資源 : Monograph/item
    正題名/作者: Advanced materials and components for 5G and beyond/ by Colin Tong.
    作者: Tong, Xingcun Colin.
    出版者: Cham :Springer Nature Switzerland : : 2022.,
    面頁冊數: xix, 261 p. :ill., digital ;24 cm.
    內容註: Chapter 1. 5G technology components and material solutions for hardware system integration -- Chapter 2. Semiconductor solutions for 5G -- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits -- Chapter 4. PCB materials and design requirements for 5G systems -- Chapter 5. Materials for high frequency filters -- Chapter 6. EMI shielding materials and absorbers for 5G communications -- Chapter 7. Thermal management materials and components for 5G devices -- Chapter 8. Protective packaging and sealing materials for 5G mobile devices -- Chapter 9. Perspectives on 5G and beyond applications and related technologies.
    Contained By: Springer Nature eBook
    標題: 5G mobile communication systems - Equipment and supplies. -
    電子資源: https://doi.org/10.1007/978-3-031-17207-6
    ISBN: 9783031172076
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