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Advanced driver assistance systems a...

Li, Yan.

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Advanced driver assistance systems and autonomous vehicles = from fundamentals to applications /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Advanced driver assistance systems and autonomous vehicles/ edited by Yan Li, Hualiang Shi.
Reminder of title:	from fundamentals to applications /
other author:	Li, Yan.
Published:	Singapore :Springer Nature Singapore : : 2022.,
Description:	vi, 629 p. :ill., digital ;24 cm.
[NT 15003449]:	Chapter 1 - Introduction -- Chapter 2 - Basics and Applications of AI in ADAS and Autonomous Vehicles -- Chapter 3 - Computing Technology in Autonomous Vehicle -- Chapter 4 - Overview of Packaging Technologies and Cooling Solutions in ADAS market -- Chapter 5 - Flash Memory and NAND -- Chapter 6 - Interconnect -- Chapter 7 - Cameras in Advanced Driver-Assistance Systems and Autonomous Driving Vehicles -- Chapter 8 - Lidar technology -- Chapter 9 - Radar Technology -- Chapter 10 - Electrochemical Power Systems for Advanced Driver-Assistant Vehicles -- Chapter 11 - In-Vehicle Display Technology -- Chapter 12 - Disk drive for data center storage -- Chapter 13 - Role and responsibility of hardware reliability engineer -- Chapter 14 - Failure Analysis in Advanced Driver Assistance Systems -- Chapter 15 - Corrosion mechanisms of copper and gold ball bonds in semiconductor packages.
Contained By:	Springer Nature eBook
Subject:	Automated vehicles. -
Online resource:	https://doi.org/10.1007/978-981-19-5053-7
ISBN:	9789811950537

Advanced driver assistance systems and autonomous vehicles = from fundamentals to applications /
Advanced driver assistance systems and autonomous vehiclesfrom fundamentals to applications /[electronic resource] :edited by Yan Li, Hualiang Shi. - Singapore :Springer Nature Singapore :2022. - vi, 629 p. :ill., digital ;24 cm.

Chapter 1 - Introduction -- Chapter 2 - Basics and Applications of AI in ADAS and Autonomous Vehicles -- Chapter 3 - Computing Technology in Autonomous Vehicle -- Chapter 4 - Overview of Packaging Technologies and Cooling Solutions in ADAS market -- Chapter 5 - Flash Memory and NAND -- Chapter 6 - Interconnect -- Chapter 7 - Cameras in Advanced Driver-Assistance Systems and Autonomous Driving Vehicles -- Chapter 8 - Lidar technology -- Chapter 9 - Radar Technology -- Chapter 10 - Electrochemical Power Systems for Advanced Driver-Assistant Vehicles -- Chapter 11 - In-Vehicle Display Technology -- Chapter 12 - Disk drive for data center storage -- Chapter 13 - Role and responsibility of hardware reliability engineer -- Chapter 14 - Failure Analysis in Advanced Driver Assistance Systems -- Chapter 15 - Corrosion mechanisms of copper and gold ball bonds in semiconductor packages.

ISBN: 9789811950537

Standard No.: 10.1007/978-981-19-5053-7doiSubjects--Topical Terms:

3443235
Automated vehicles.

LC Class. No.: TL152.8 / .A38 2022

Dewey Class. No.: 629.2046

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245 0 0 $a Advanced driver assistance systems and autonomous vehicles $h [electronic resource] : $b from fundamentals to applications / $c edited by Yan Li, Hualiang Shi.
260 $a Singapore : $b Springer Nature Singapore : $b Imprint: Springer, $c 2022.
300 $a vi, 629 p. : $b ill., digital ; $c 24 cm.
505 0 $a Chapter 1 - Introduction -- Chapter 2 - Basics and Applications of AI in ADAS and Autonomous Vehicles -- Chapter 3 - Computing Technology in Autonomous Vehicle -- Chapter 4 - Overview of Packaging Technologies and Cooling Solutions in ADAS market -- Chapter 5 - Flash Memory and NAND -- Chapter 6 - Interconnect -- Chapter 7 - Cameras in Advanced Driver-Assistance Systems and Autonomous Driving Vehicles -- Chapter 8 - Lidar technology -- Chapter 9 - Radar Technology -- Chapter 10 - Electrochemical Power Systems for Advanced Driver-Assistant Vehicles -- Chapter 11 - In-Vehicle Display Technology -- Chapter 12 - Disk drive for data center storage -- Chapter 13 - Role and responsibility of hardware reliability engineer -- Chapter 14 - Failure Analysis in Advanced Driver Assistance Systems -- Chapter 15 - Corrosion mechanisms of copper and gold ball bonds in semiconductor packages.
650 0 $a Automated vehicles. $3 3443235
650 0 $a Driver assistance systems. $3 1569172
650 1 4 $a Vehicle Engineering. $3 3592516
650 2 4 $a Control, Robotics, Automation. $3 3592500
650 2 4 $a Artificial Intelligence. $3 769149
700 1 $a Li, Yan. $3 1028952
700 1 $a Shi, Hualiang. $3 3607155
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