東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Investigating Thermo-Fluidic Perform...

Jung, Ki Wook.

FindBook

Google Book

Amazon

博客來

Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications./
作者:	Jung, Ki Wook.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2020,
面頁冊數:	140 p.
附註:	Source: Dissertations Abstracts International, Volume: 82-02, Section: B.
Contained By:	Dissertations Abstracts International82-02B.
標題:	Thermodynamics. -
電子資源:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28104043
ISBN:	9798662511286

Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications.
Jung, Ki Wook.

Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications. - Ann Arbor : ProQuest Dissertations & Theses, 2020 - 140 p.

Source: Dissertations Abstracts International, Volume: 82-02, Section: B.

Thesis (Ph.D.)--Stanford University, 2020.

This item must not be sold to any third party vendors.

High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. However, the continued drive for higher device and packaging densities has led to extreme heat fluxes on the order of 1 kW/cm2 that requires aggressive microchannel cooling strategies in order to maintain the device junction temperature ~200°C. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in 2D-plane. Utilizing direct "embedded cooling" strategy in combination with top access 3D-manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. This dissertation presents a series of studies to develop an effective microchannel-based heat exchanger with a fluid router system, the Embedded Microchannels-3D Manifold Cooler (or EMMC). The overall microfabrication efforts for the EMMCs are presented. The configuration of the target EMMC design is introduced and two major fabrication challenges are discussed. For single-phase flow, thermo-fluidic behavior of the EMMC is experimentally examined and validated by a conjugate numerical simulation model. DI water and R-245fa are used as working fluids and the maximum heat transfer rate of 100 kW/m2-K was measured with DI water. Furthermore, the conjugate numerical simulation modeling is heavily used to predict the geometric effect on the thermo-fluidic performance of different EMMCs and used to develop correlations to predict friction factor and Nusselt number of the system. For two-phase flow, forced-convective subcooled boiling is confirmed by the experiments and a systematic trial to calculate exit vapor quality has been made based on a few assumptions. The highly pressurized subcooled boiling delays onset-of-nucleate boiling in the microchannels and this strong condensation effect allows the EMMC to remove higher heat fluxes with low void fraction inside of the channels. The present research motivates further study into flow visualization and different types of boiling heat transfer. The better understanding to the underlying physics of the EMMC will be a key to develop more effective heat exchanger design for high-power density applications.

ISBN: 9798662511286Subjects--Topical Terms:

517304
Thermodynamics.
Subjects--Index Terms:

Thermofluidics

Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications.
LDR:03663nmm a2200349 4500 001 2281288
005 20210910100701.5
008 220723s2020 ||||||||||||||||| ||eng d
020 $a 9798662511286
035 $a (MiAaPQ)AAI28104043
035 $a (MiAaPQ)STANFORDzb171kw6421
035 $a AAI28104043
040 $a MiAaPQ $c MiAaPQ
100 1 $a Jung, Ki Wook. $3 3559870
245 1 0 $a Investigating Thermo-Fluidic Performance of Si-Based Embedded Microchannels-3D Manifold Cooling System for High Power Density Electronic Applications.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2020
300 $a 140 p.
500 $a Source: Dissertations Abstracts International, Volume: 82-02, Section: B.
500 $a Advisor: Goodson, Kenneth;Asheghi, Mehdi;Senesky, Debbie.
502 $a Thesis (Ph.D.)--Stanford University, 2020.
506 $a This item must not be sold to any third party vendors.
520 $a High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. However, the continued drive for higher device and packaging densities has led to extreme heat fluxes on the order of 1 kW/cm2 that requires aggressive microchannel cooling strategies in order to maintain the device junction temperature ~200°C. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in 2D-plane. Utilizing direct "embedded cooling" strategy in combination with top access 3D-manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. This dissertation presents a series of studies to develop an effective microchannel-based heat exchanger with a fluid router system, the Embedded Microchannels-3D Manifold Cooler (or EMMC). The overall microfabrication efforts for the EMMCs are presented. The configuration of the target EMMC design is introduced and two major fabrication challenges are discussed. For single-phase flow, thermo-fluidic behavior of the EMMC is experimentally examined and validated by a conjugate numerical simulation model. DI water and R-245fa are used as working fluids and the maximum heat transfer rate of 100 kW/m2-K was measured with DI water. Furthermore, the conjugate numerical simulation modeling is heavily used to predict the geometric effect on the thermo-fluidic performance of different EMMCs and used to develop correlations to predict friction factor and Nusselt number of the system. For two-phase flow, forced-convective subcooled boiling is confirmed by the experiments and a systematic trial to calculate exit vapor quality has been made based on a few assumptions. The highly pressurized subcooled boiling delays onset-of-nucleate boiling in the microchannels and this strong condensation effect allows the EMMC to remove higher heat fluxes with low void fraction inside of the channels. The present research motivates further study into flow visualization and different types of boiling heat transfer. The better understanding to the underlying physics of the EMMC will be a key to develop more effective heat exchanger design for high-power density applications.
590 $a School code: 0212.
650 4 $a Thermodynamics. $3 517304
650 4 $a Fluid mechanics. $3 528155
650 4 $a Mechanical engineering. $3 649730
653 $a Thermofluidics
653 $a Heat exchangers
690 $a 0548
690 $a 0204
690 $a 0348
710 2 $a Stanford University. $3 754827
773 0 $t Dissertations Abstracts International $g 82-02B.
790 $a 0212
791 $a Ph.D.
792 $a 2020
793 $a English
856 4 0 $u https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28104043