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Exploration and adaptation of silico...

Ramadas, Padmaja.

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Exploration and adaptation of silicon MEMS technology for development of water and liquid metal based micro heat pipes.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Exploration and adaptation of silicon MEMS technology for development of water and liquid metal based micro heat pipes./
Author:	Ramadas, Padmaja.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 1997,
Description:	270 p.
Notes:	Source: Dissertations Abstracts International, Volume: 59-03, Section: B.
Contained By:	Dissertations Abstracts International59-03B.
Subject:	Electrical engineering. -
Online resource:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9735057
ISBN:	9780591448047

Exploration and adaptation of silicon MEMS technology for development of water and liquid metal based micro heat pipes.
Ramadas, Padmaja.

Exploration and adaptation of silicon MEMS technology for development of water and liquid metal based micro heat pipes. - Ann Arbor : ProQuest Dissertations & Theses, 1997 - 270 p.

Source: Dissertations Abstracts International, Volume: 59-03, Section: B.

Thesis (Ph.D.)--University of Cincinnati, 1997.

This item must not be sold to any third party vendors.

The purpose of this thesis is to describe a developing and potentially revolutionary technology for micromachining arrays of micro heat pipes in single crystalline semiconductor silicon in order to fabricate light-weight electronic cooling systems by using wet-chemical etching. This technology has been successfully utilized to etch 100$\\mu$m and 250$\\mu$m wide v-shaped grooves in (100) silicon in this work along with the associated microplumbing and packaging processes. When these grooves are filled with water or methanol and sealed, they can be used as low temperature (50$\\sp\\circ$C-70$\\sp\\circ$C) micro heat pipes. If these pipes are filled with liquid metals, namely sodium, potassium or mercury they can be used for higher temperatures. Only the materials technology has been explored for the latter in this work. Micro heat pipes are small scale structures which may be used to cool microelectronic chips and space systems. Currently at the University of Cincinnati, micro heat pipes of 100$\\mu$m and 250$\\mu$m wide, 1" long and 100$\\mu$m spaced apart have been built and preliminarily tested. It is expected that the pipes will be able to dissipate heat fluxes on the order of 10-15 W/cm$\\sp2$. Integrated P-N junctions have been fabricated to measure the temperature distribution across the wafer. An integrated p-type resistor has been fabricated into the wafer to supply power to the devices. For the high temperature micro heat pipes, polysilicon temperature sensors and thin film resistors have been successfully fabricated. Preliminary heat transfer studies have been done by the associated thermal sciences team and the author has concluded some initial evaluations. These pipes have been sealed by electrostatic bonding and microplumbing of the pipes for filling the micro heat pipes has been achieved by a newly developed method with the aid of electrostatic bonding of Pyrex tubing. The fabrication and instrumentation of the micro heat pipes are described in this work. Additionally, theory and experimental methods for pipe filling, testing, and data collection, with some experimental results, are presented. Future research directions and suggestions are offered.

ISBN: 9780591448047Subjects--Topical Terms:

649834
Electrical engineering.
Subjects--Index Terms:

electrostatic bonding

Exploration and adaptation of silicon MEMS technology for development of water and liquid metal based micro heat pipes.
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500 $a Source: Dissertations Abstracts International, Volume: 59-03, Section: B.
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520 $a The purpose of this thesis is to describe a developing and potentially revolutionary technology for micromachining arrays of micro heat pipes in single crystalline semiconductor silicon in order to fabricate light-weight electronic cooling systems by using wet-chemical etching. This technology has been successfully utilized to etch 100$\\mu$m and 250$\\mu$m wide v-shaped grooves in (100) silicon in this work along with the associated microplumbing and packaging processes. When these grooves are filled with water or methanol and sealed, they can be used as low temperature (50$\\sp\\circ$C-70$\\sp\\circ$C) micro heat pipes. If these pipes are filled with liquid metals, namely sodium, potassium or mercury they can be used for higher temperatures. Only the materials technology has been explored for the latter in this work. Micro heat pipes are small scale structures which may be used to cool microelectronic chips and space systems. Currently at the University of Cincinnati, micro heat pipes of 100$\\mu$m and 250$\\mu$m wide, 1" long and 100$\\mu$m spaced apart have been built and preliminarily tested. It is expected that the pipes will be able to dissipate heat fluxes on the order of 10-15 W/cm$\\sp2$. Integrated P-N junctions have been fabricated to measure the temperature distribution across the wafer. An integrated p-type resistor has been fabricated into the wafer to supply power to the devices. For the high temperature micro heat pipes, polysilicon temperature sensors and thin film resistors have been successfully fabricated. Preliminary heat transfer studies have been done by the associated thermal sciences team and the author has concluded some initial evaluations. These pipes have been sealed by electrostatic bonding and microplumbing of the pipes for filling the micro heat pipes has been achieved by a newly developed method with the aid of electrostatic bonding of Pyrex tubing. The fabrication and instrumentation of the micro heat pipes are described in this work. Additionally, theory and experimental methods for pipe filling, testing, and data collection, with some experimental results, are presented. Future research directions and suggestions are offered.
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