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Additively Manufactured Ku-Band Grou...

Senckowski, Alexander Zenon.

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Additively Manufactured Ku-Band Grounded Coplanar Waveguide Microwave Connectors.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Additively Manufactured Ku-Band Grounded Coplanar Waveguide Microwave Connectors./
Author:	Senckowski, Alexander Zenon.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 2020,
Description:	138 p.
Notes:	Source: Masters Abstracts International, Volume: 81-09.
Contained By:	Masters Abstracts International81-09.
Subject:	Electrical engineering. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=27665901
ISBN:	9781392672709

Additively Manufactured Ku-Band Grounded Coplanar Waveguide Microwave Connectors.
Senckowski, Alexander Zenon.

Additively Manufactured Ku-Band Grounded Coplanar Waveguide Microwave Connectors. - Ann Arbor : ProQuest Dissertations & Theses, 2020 - 138 p.

Source: Masters Abstracts International, Volume: 81-09.

Thesis (M.S.Eng.)--University of Massachusetts Lowell, 2020.

This item must not be sold to any third party vendors.

In many radio frequency (RF) and microwave systems it is necessary to connect standard printed circuit boards (PCB) or packaged devices together. Commercial-Off-The-Shelf (COTS) connectors such as 3.5 mm connectors or SMA connectors are typically used for realizing these connections. There is growing interest in printing RF/microwave devices and systems that are not rigid and planar (like standard PCBs) but possibly flexible, conformable or embedded into a 3D object. The form factor of typical RF/microwave COTS connectors may not be appropriate for these new forms of electronics and will require the development of new approaches to connector design.This work was started to address the challenges to developing connectors with geometries and material properties appropriate for these new form factors for RF/microwave electronic systems. This thesis describes the development of additively manufactured (AM), 3D printed Ku-band (12 GHz to 18 GHz) grounded coplanar waveguide (GCPW) microwave connectors. It is believed this work is the first demonstration of additive manufacturing technology for the development of planar high frequency connectors.The work described in this thesis involves all elements of connector development including electromagnetic simulation of multiple designs, development of printing technologies for connector fabrication as well as measurement techniques for printed connectors and materials used in their fabrication.Models for AM GCPW connectors are developed using ANSYS high frequency structure simulator (HFSS) software which incorporate measured material properties including dielectric and conductive materials.Many iterations of GCPW devices are fabricated and tested to better understand the relationship between initial measured and simulated results. Fused filament fabrication (FFF), also known as fused deposition modeling (FDM), is used to fabricate the AM GCPW connector substrates out of high temperature thermoplastic (ULTEM 9085). All AM fabrication is performed with a single four-tool machine. Two methods are developed to create the conductive ink traces for the AM GCPW connectors (directly writing conductive ink patterns and it is believed a novel ink drawdown/milling method).A measurement process using a vector network analyzer and wafer probing station is developed for the GCPW connectors which requires using an upside-down RF probe. Although more work needs to be done to improve the performance of the AM GCPW connectors, working AM GCPW connectors are fabricated and measured which lays the groundwork for future improvements.

ISBN: 9781392672709Subjects--Topical Terms:

649834
Electrical engineering.
Subjects--Index Terms:

Additive manufacturing

Additively Manufactured Ku-Band Grounded Coplanar Waveguide Microwave Connectors.
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506 $a This item must not be sold to any third party vendors.
520 $a In many radio frequency (RF) and microwave systems it is necessary to connect standard printed circuit boards (PCB) or packaged devices together. Commercial-Off-The-Shelf (COTS) connectors such as 3.5 mm connectors or SMA connectors are typically used for realizing these connections. There is growing interest in printing RF/microwave devices and systems that are not rigid and planar (like standard PCBs) but possibly flexible, conformable or embedded into a 3D object. The form factor of typical RF/microwave COTS connectors may not be appropriate for these new forms of electronics and will require the development of new approaches to connector design.This work was started to address the challenges to developing connectors with geometries and material properties appropriate for these new form factors for RF/microwave electronic systems. This thesis describes the development of additively manufactured (AM), 3D printed Ku-band (12 GHz to 18 GHz) grounded coplanar waveguide (GCPW) microwave connectors. It is believed this work is the first demonstration of additive manufacturing technology for the development of planar high frequency connectors.The work described in this thesis involves all elements of connector development including electromagnetic simulation of multiple designs, development of printing technologies for connector fabrication as well as measurement techniques for printed connectors and materials used in their fabrication.Models for AM GCPW connectors are developed using ANSYS high frequency structure simulator (HFSS) software which incorporate measured material properties including dielectric and conductive materials.Many iterations of GCPW devices are fabricated and tested to better understand the relationship between initial measured and simulated results. Fused filament fabrication (FFF), also known as fused deposition modeling (FDM), is used to fabricate the AM GCPW connector substrates out of high temperature thermoplastic (ULTEM 9085). All AM fabrication is performed with a single four-tool machine. Two methods are developed to create the conductive ink traces for the AM GCPW connectors (directly writing conductive ink patterns and it is believed a novel ink drawdown/milling method).A measurement process using a vector network analyzer and wafer probing station is developed for the GCPW connectors which requires using an upside-down RF probe. Although more work needs to be done to improve the performance of the AM GCPW connectors, working AM GCPW connectors are fabricated and measured which lays the groundwork for future improvements.
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653 $a Microwave
653 $a Printed electronics
653 $a Radio frequency
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