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Embedded passive devices in flexible...

Lenihan, Timothy G.

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Embedded passive devices in flexible polyimide films.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Embedded passive devices in flexible polyimide films./
Author:	Lenihan, Timothy G.
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 1996,
Description:	346 p.
Notes:	Source: Dissertations Abstracts International, Volume: 62-08, Section: B.
Contained By:	Dissertations Abstracts International62-08B.
Subject:	Electrical engineering. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9987279
ISBN:	9780599947016

Embedded passive devices in flexible polyimide films.
Lenihan, Timothy G.

Embedded passive devices in flexible polyimide films. - Ann Arbor : ProQuest Dissertations & Theses, 1996 - 346 p.

Source: Dissertations Abstracts International, Volume: 62-08, Section: B.

Thesis (Ph.D.)--University of Arkansas, 1996.

This item must not be sold to any third party vendors.

The High Density Electronics Center (HiDEC) at the University of Arkansas is working with the Sheldahl MCM-L Consortium and Rensselaer Polytechnic Institute (RPI) to develop low-cost embedded resistors, capacitors, and inductors in flexible polyimide films under an ARPA contract. Representatives from the government, automotive, aerospace, communications, and design industries are formation members. Sheldahl is a manufacturer of low-cost flexible circuits using a reel to reel process. RPI has materials expertise in the area of dielectric films. HiDEC's responsibility is to develop the design component, processes, evaluate reliability, and transfer the technology to Sheldahl for full scale manufacture. Embedding thin-film passive devices into polyimide layers as part of a Multichip Module (MCM) system is new. The design concept allows fabrication and testing of embedded passive devices before assembling them into an MCM-L substrate. Embedded passive devices are needed as an enhancement to present day MCM-L and MCM-D technologies. The ability to remove devices such as terminating resistors and decoupling capacitors from the surfaces of PCB boards and MCMs into a flexible film, at low cost, would be a break-through for MCM technology. The materials being used are NiCr, TaN, and CrSi for the resistors and TaXOY and BaTiOX or the capacitors. Contacts, interconnecting signal lines, and power lines are made with Cu metallurgy. The devices are made on a 25 μm or 50 μm thick polyimide film and are encapsulated with the same polyimide. Test vehicles incorporating a full range of standard value' passive devices with characterization, tuned circuit, and reliability structures are being used to develop this technology. Fully processed devices have been evaluated at high frequencies (1.8 GHz) and effects due to capacitive coupling within devices and with external materials near the devices have been modeled. An initial set of reliability evaluations have been performed to access potential failure mechanisms such as mechanical stress. TCR and frequency analysis studies show the characteristics of these types of embedded devices. Potential applications for portable electronics and wireless technologies for flexible MCMs are clear and are discussed.

ISBN: 9780599947016Subjects--Topical Terms:

649834
Electrical engineering.
Subjects--Index Terms:

Capacitors

Embedded passive devices in flexible polyimide films.
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245 1 0 $a Embedded passive devices in flexible polyimide films.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 1996
300 $a 346 p.
500 $a Source: Dissertations Abstracts International, Volume: 62-08, Section: B.
500 $a Publisher info.: Dissertation/Thesis.
500 $a Advisor: Brown, William D.
502 $a Thesis (Ph.D.)--University of Arkansas, 1996.
506 $a This item must not be sold to any third party vendors.
506 $a This item must not be added to any third party search indexes.
520 $a The High Density Electronics Center (HiDEC) at the University of Arkansas is working with the Sheldahl MCM-L Consortium and Rensselaer Polytechnic Institute (RPI) to develop low-cost embedded resistors, capacitors, and inductors in flexible polyimide films under an ARPA contract. Representatives from the government, automotive, aerospace, communications, and design industries are formation members. Sheldahl is a manufacturer of low-cost flexible circuits using a reel to reel process. RPI has materials expertise in the area of dielectric films. HiDEC's responsibility is to develop the design component, processes, evaluate reliability, and transfer the technology to Sheldahl for full scale manufacture. Embedding thin-film passive devices into polyimide layers as part of a Multichip Module (MCM) system is new. The design concept allows fabrication and testing of embedded passive devices before assembling them into an MCM-L substrate. Embedded passive devices are needed as an enhancement to present day MCM-L and MCM-D technologies. The ability to remove devices such as terminating resistors and decoupling capacitors from the surfaces of PCB boards and MCMs into a flexible film, at low cost, would be a break-through for MCM technology. The materials being used are NiCr, TaN, and CrSi for the resistors and TaXOY and BaTiOX or the capacitors. Contacts, interconnecting signal lines, and power lines are made with Cu metallurgy. The devices are made on a 25 μm or 50 μm thick polyimide film and are encapsulated with the same polyimide. Test vehicles incorporating a full range of standard value' passive devices with characterization, tuned circuit, and reliability structures are being used to develop this technology. Fully processed devices have been evaluated at high frequencies (1.8 GHz) and effects due to capacitive coupling within devices and with external materials near the devices have been modeled. An initial set of reliability evaluations have been performed to access potential failure mechanisms such as mechanical stress. TCR and frequency analysis studies show the characteristics of these types of embedded devices. Potential applications for portable electronics and wireless technologies for flexible MCMs are clear and are discussed.
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650 4 $a Condensation. $3 942542
650 4 $a Electromagnetism. $3 522050
650 4 $a Materials science. $3 543314
653 $a Capacitors
653 $a Embedded passive devices
653 $a Inductors
653 $a Polyimide films
653 $a Resistors
690 $a 0544
690 $a 0611
690 $a 0607
690 $a 0794
710 2 $a University of Arkansas. $3 1017562
773 0 $t Dissertations Abstracts International $g 62-08B.
790 $a 0011
791 $a Ph.D.
792 $a 1996
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9987279