東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Embedded mechatronic systems.. 2,. A...

Pougnet, Philippe,

FindBook

Google Book

Amazon

博客來

Embedded mechatronic systems.. 2,. Analyses of failures, modeling, simulation and optimization

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Embedded mechatronic systems./ edited by Abdelkhalak El Hami, Philippe Pougnet.
其他題名:	Analyses of failures, modeling, simulation and optimization
其他作者:	Pougnet, Philippe,
出版者:	London :ISTE, Ltd. ; : 2020.,
面頁冊數:	1 online resource (300 p.)
附註:	9.1. Introduction
內容註:	Front Cover -- Embedded Mechatronic Systems 2: Analyses of Failures, Modeling, Simulation and Optimization -- Copyright page -- Contents -- Preface -- 1. Highly Accelerated Testing -- 1.1. Introduction -- 1.2. Load characteristics of the Super HAT equipment -- 1.3. Description of the Super HAT system -- 1.4. Application -- 1.5. Conclusion -- 1.6. References -- 2. Aging Power Transistors in Operational Conditions -- 2.1. Introduction -- 2.2. Aging microwave power electronic components under operational conditions -- 2.3. Application to the study of microwave power transistors
內容註:	2.4. Conclusion -- 2.5. References -- 3. Physical Defects Analysis of Mechatronic Systems -- 3.1. Introduction -- 3.2. Equipment and methodology for analyzing failure inmechatronic systems -- 3.3. Analysis of physical defects -- 3.4. Conclusion -- 3.5. References -- 4. Impact of Voids in Interconnection Materials -- 4.1. Introduction -- 4.2. Thermal transfer and thermo-elasticity -- 4.3. Description of the numerical method -- 4.4. Simulation of thermal and thermomechanical effects in the interconnection material of an electronic module -- 4.5. Conclusion -- 4.6. References
內容註:	5. Electro-Thermo-Mechanical Modeling -- 5.1. Introduction -- 5.2. Theory of electro-thermo-mechanical coupling -- 5.3. Simulation of electro-thermo-mechanical behavior using the finite element method -- 5.4. Example of an electro-thermo-mechanical simulation of an HBT transistor -- 5.5. Modal analysis of mechanical components -- 5.6. Stochastic modal analysis of structures -- 5.7. Numerical identification of the elastic parameters of electronic components -- 5.8. Example of modeling and simulation of the vibratory behavior of mechatronic components -- 5.9. Conclusion
內容註:	5.10. List of abbreviations and symbols -- 5.11. References -- 6. Meta-Model Development -- 6.1. Introduction -- 6.2. Definition of a meta-model -- 6.3. Selection of factors: screening -- 6.4. Creation of designs of experiments -- 6.5. Modeling of the response surface: PLS regression and Kriging -- 6.6. Sensitivity analysis of the model: variance decomposition, Sobol criterion -- 6.7. Robust design -- 6.8. Conclusion -- 6.9. References -- 7. Probabilistic Study and Optimization of a Solder Interconnect -- 7.1. Introduction -- 7.2. Electronic equipment
內容註:	7.3. Thermal modeling of the electronic board -- 7.4. Probabilistic study of the effect of thermomechanical stresses on a solder joint -- 7.5. Optimization of the solder joint -- 7.6. Conclusion -- 7.7. References -- 8. High-Efficiency Architecture for Power Amplifiers -- 8.1. Introduction -- 8.2. Main reliability parameters -- 8.3. Methodology -- 8.4. Aging tests -- 8.5. Other results -- 8.6. Origin of degradations: discussion -- 8.7. Physical analysis -- 8.8. Amplifier design rules -- 8.9. Conclusion -- 8.10. References -- 9. Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP)
標題:	Embedded computer systems. -
電子資源:	https://www.sciencedirect.com/science/book/9781785481901
ISBN:	9780081019566 (electronic bk.)

Embedded mechatronic systems.. 2,. Analyses of failures, modeling, simulation and optimization
Embedded mechatronic systems.2,Analyses of failures, modeling, simulation and optimization[electronic resource] /Analyses of failures, modeling, simulation and optimizationedited by Abdelkhalak El Hami, Philippe Pougnet. - Second edition. - London :ISTE, Ltd. ;2020. - 1 online resource (300 p.)

9.1. Introduction

Front Cover -- Embedded Mechatronic Systems 2: Analyses of Failures, Modeling, Simulation and Optimization -- Copyright page -- Contents -- Preface -- 1. Highly Accelerated Testing -- 1.1. Introduction -- 1.2. Load characteristics of the Super HAT equipment -- 1.3. Description of the Super HAT system -- 1.4. Application -- 1.5. Conclusion -- 1.6. References -- 2. Aging Power Transistors in Operational Conditions -- 2.1. Introduction -- 2.2. Aging microwave power electronic components under operational conditions -- 2.3. Application to the study of microwave power transistors

ISBN: 9780081019566 (electronic bk.)Subjects--Topical Terms:

582088
Embedded computer systems.
Index Terms--Genre/Form:

959526
Electronic books

LC Class. No.: TJ163.12 / .E63 2020

Dewey Class. No.: 006.2/2

Embedded mechatronic systems.. 2,. Analyses of failures, modeling, simulation and optimization
LDR:03994cmm a2200325 a 4500 001 2246034
006 m o d
007 cr cnu---unuuu
008 211223s2020 enka go 000 0 eng d
020 $a 9780081019566 (electronic bk.)
020 $a 0081019564 (electronic bk.)
020 $a 9781785481901
020 $a 1785481908
035 $a (OCoLC)1143639151
035 $a on1143639151
040 $a EBLCP $b eng $c EBLCP $d OPELS $d UKAHL $d YDXIT $d OCLCQ $d AU@ $d YDX $d OCLCQ $d OCLCF $d OCLCQ
041 0 $a eng
050 4 $a TJ163.12 $b .E63 2020
082 0 4 $a 006.2/2 $2 23
245 0 0 $a Embedded mechatronic systems. $n 2, $p Analyses of failures, modeling, simulation and optimization $h [electronic resource] / $c edited by Abdelkhalak El Hami, Philippe Pougnet.
246 3 0 $a Analyses of failures, modeling, simulation and optimization
250 $a Second edition.
260 $a London : $b ISTE, Ltd. ; $a Kidlington : $b Elsevier, $c 2020.
300 $a 1 online resource (300 p.)
500 $a 9.1. Introduction
505 0 $a Front Cover -- Embedded Mechatronic Systems 2: Analyses of Failures, Modeling, Simulation and Optimization -- Copyright page -- Contents -- Preface -- 1. Highly Accelerated Testing -- 1.1. Introduction -- 1.2. Load characteristics of the Super HAT equipment -- 1.3. Description of the Super HAT system -- 1.4. Application -- 1.5. Conclusion -- 1.6. References -- 2. Aging Power Transistors in Operational Conditions -- 2.1. Introduction -- 2.2. Aging microwave power electronic components under operational conditions -- 2.3. Application to the study of microwave power transistors
505 8 $a 2.4. Conclusion -- 2.5. References -- 3. Physical Defects Analysis of Mechatronic Systems -- 3.1. Introduction -- 3.2. Equipment and methodology for analyzing failure inmechatronic systems -- 3.3. Analysis of physical defects -- 3.4. Conclusion -- 3.5. References -- 4. Impact of Voids in Interconnection Materials -- 4.1. Introduction -- 4.2. Thermal transfer and thermo-elasticity -- 4.3. Description of the numerical method -- 4.4. Simulation of thermal and thermomechanical effects in the interconnection material of an electronic module -- 4.5. Conclusion -- 4.6. References
505 8 $a 5. Electro-Thermo-Mechanical Modeling -- 5.1. Introduction -- 5.2. Theory of electro-thermo-mechanical coupling -- 5.3. Simulation of electro-thermo-mechanical behavior using the finite element method -- 5.4. Example of an electro-thermo-mechanical simulation of an HBT transistor -- 5.5. Modal analysis of mechanical components -- 5.6. Stochastic modal analysis of structures -- 5.7. Numerical identification of the elastic parameters of electronic components -- 5.8. Example of modeling and simulation of the vibratory behavior of mechatronic components -- 5.9. Conclusion
505 8 $a 5.10. List of abbreviations and symbols -- 5.11. References -- 6. Meta-Model Development -- 6.1. Introduction -- 6.2. Definition of a meta-model -- 6.3. Selection of factors: screening -- 6.4. Creation of designs of experiments -- 6.5. Modeling of the response surface: PLS regression and Kriging -- 6.6. Sensitivity analysis of the model: variance decomposition, Sobol criterion -- 6.7. Robust design -- 6.8. Conclusion -- 6.9. References -- 7. Probabilistic Study and Optimization of a Solder Interconnect -- 7.1. Introduction -- 7.2. Electronic equipment
505 8 $a 7.3. Thermal modeling of the electronic board -- 7.4. Probabilistic study of the effect of thermomechanical stresses on a solder joint -- 7.5. Optimization of the solder joint -- 7.6. Conclusion -- 7.7. References -- 8. High-Efficiency Architecture for Power Amplifiers -- 8.1. Introduction -- 8.2. Main reliability parameters -- 8.3. Methodology -- 8.4. Aging tests -- 8.5. Other results -- 8.6. Origin of degradations: discussion -- 8.7. Physical analysis -- 8.8. Amplifier design rules -- 8.9. Conclusion -- 8.10. References -- 9. Reliability Analysis based on Metamodels of Chip-Scale Packages (CSP)
650 0 $a Embedded computer systems. $3 582088
650 0 $a Mechatronics. $3 737861
655 4 $a Electronic books $3 959526
655 4 $a Electronic books. $2 lcsh $3 542853
700 1 $a Pougnet, Philippe, $e editor. $3 3508961
700 1 $a El Hami, Abdelkhalak, $e editor. $3 3452009
856 4 0 $u https://www.sciencedirect.com/science/book/9781785481901