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Nano-bio-electronic, photonic and MEMS packaging

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Nano-bio-electronic, photonic and MEMS packaging/ edited by C. P.(Ching-Ping) Wong, Kyoung-sik (Jack) Moon, Yi Li.
其他作者:	Wong, C. P.(Ching-Ping).
出版者:	Cham :Springer International Publishing : : 2021.,
面頁冊數:	xiii, 582 p. :ill., digital ;24 cm.
內容註:	Part1. Electronics (electrical interconnections and thermal management) -- Chapter 1.Nanomaterials for Microelectronics, Biomedical, MEMS, and Energy Devices Packaging -- Chapter 2. Nano-conductive Adhesives for Nano-electronics Interconnection -- Chapter 3. Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials -- Chapter 4. Nanomaterials via Nano Spray Combustion Chemical Vapor Condensation, and Their Electronic Applications -- Chapter 5. Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging -- Chapter 6. Introduction to Nanoparticle-Based Integrated Passives -- Chapter 7. Thermally Conductive Nanocomposites -- Chapter 8. Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC)Packages: Review and Extension -- Chapter 9. On-Chip Thermal Management and Hot-Spot Remediation -- Chapter 10. Some Aspects of Microchannel Heat Transfer -- Part II.BioMEMs packaging -- Chapter 11. Nanoprobes for Live-Cell Gene Detection -- Chapter 12. Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips -- Chapter 13. Packaging of Biomolecular and Chemical Microsensors -- Chapter 14. Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging -- Chapter 15. Biomimetic Lotus Effect Surfaces for Nanopackaging -- Part III. Wearable devices packaging and materials -- Chapter 16. Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronics -- Part IV. Biomedical devices packaging -- Chapter 17. Evolution of Advanced Miniaturization for Active Implantable Medical Devices -- Part V. Optical device packaging -- Chapter 18. An introduction of the phosphor converted white LED packaging and its reliability -- Part VI. Energy harvesting -- Chapter 19. Mechanical Energy Harvesting Using Wurtzite Nanowires -- Chapter 20. 1D Nanowire Electrode Materials for Power Sources of Microelectronics -- Part VII. Energy storage (LIB battery) -- Chapter 21. Graphene-based materials with tailored nanostructures for lithium-ion batteries -- Part VIII. Energy storage (supercapacitor) -- Chapter 22. Fe-Based Anode Materials for Asymmetric Supercapacitors -- Part XI. Metrology -- Chapter 23. Nanoscale Deformation and Strain Analysis by AFM/DIC Technique -- Part X. Computational -- Chapter 24. Molecular Dynamics Applications in Packaging -- Chapter 25. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.
Contained By:	Springer Nature eBook
標題:	Nanostructured materials. -
電子資源:	https://doi.org/10.1007/978-3-030-49991-4
ISBN:	9783030499914

Nano-bio-electronic, photonic and MEMS packaging
Nano-bio-electronic, photonic and MEMS packaging[electronic resource] /edited by C. P.(Ching-Ping) Wong, Kyoung-sik (Jack) Moon, Yi Li. - Second edition. - Cham :Springer International Publishing :2021. - xiii, 582 p. :ill., digital ;24 cm.

Part1. Electronics (electrical interconnections and thermal management) -- Chapter 1.Nanomaterials for Microelectronics, Biomedical, MEMS, and Energy Devices Packaging -- Chapter 2. Nano-conductive Adhesives for Nano-electronics Interconnection -- Chapter 3. Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials -- Chapter 4. Nanomaterials via Nano Spray Combustion Chemical Vapor Condensation, and Their Electronic Applications -- Chapter 5. Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging -- Chapter 6. Introduction to Nanoparticle-Based Integrated Passives -- Chapter 7. Thermally Conductive Nanocomposites -- Chapter 8. Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC)Packages: Review and Extension -- Chapter 9. On-Chip Thermal Management and Hot-Spot Remediation -- Chapter 10. Some Aspects of Microchannel Heat Transfer -- Part II.BioMEMs packaging -- Chapter 11. Nanoprobes for Live-Cell Gene Detection -- Chapter 12. Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips -- Chapter 13. Packaging of Biomolecular and Chemical Microsensors -- Chapter 14. Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging -- Chapter 15. Biomimetic Lotus Effect Surfaces for Nanopackaging -- Part III. Wearable devices packaging and materials -- Chapter 16. Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronics -- Part IV. Biomedical devices packaging -- Chapter 17. Evolution of Advanced Miniaturization for Active Implantable Medical Devices -- Part V. Optical device packaging -- Chapter 18. An introduction of the phosphor converted white LED packaging and its reliability -- Part VI. Energy harvesting -- Chapter 19. Mechanical Energy Harvesting Using Wurtzite Nanowires -- Chapter 20. 1D Nanowire Electrode Materials for Power Sources of Microelectronics -- Part VII. Energy storage (LIB battery) -- Chapter 21. Graphene-based materials with tailored nanostructures for lithium-ion batteries -- Part VIII. Energy storage (supercapacitor) -- Chapter 22. Fe-Based Anode Materials for Asymmetric Supercapacitors -- Part XI. Metrology -- Chapter 23. Nanoscale Deformation and Strain Analysis by AFM/DIC Technique -- Part X. Computational -- Chapter 24. Molecular Dynamics Applications in Packaging -- Chapter 25. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

ISBN: 9783030499914

Standard No.: 10.1007/978-3-030-49991-4doiSubjects--Topical Terms:

584856
Nanostructured materials.

LC Class. No.: TA418.9.N35 / N366 2021

Dewey Class. No.: 621.381046

Nano-bio-electronic, photonic and MEMS packaging
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505 0 $a Part1. Electronics (electrical interconnections and thermal management) -- Chapter 1.Nanomaterials for Microelectronics, Biomedical, MEMS, and Energy Devices Packaging -- Chapter 2. Nano-conductive Adhesives for Nano-electronics Interconnection -- Chapter 3. Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials -- Chapter 4. Nanomaterials via Nano Spray Combustion Chemical Vapor Condensation, and Their Electronic Applications -- Chapter 5. Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging -- Chapter 6. Introduction to Nanoparticle-Based Integrated Passives -- Chapter 7. Thermally Conductive Nanocomposites -- Chapter 8. Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC)Packages: Review and Extension -- Chapter 9. On-Chip Thermal Management and Hot-Spot Remediation -- Chapter 10. Some Aspects of Microchannel Heat Transfer -- Part II.BioMEMs packaging -- Chapter 11. Nanoprobes for Live-Cell Gene Detection -- Chapter 12. Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips -- Chapter 13. Packaging of Biomolecular and Chemical Microsensors -- Chapter 14. Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging -- Chapter 15. Biomimetic Lotus Effect Surfaces for Nanopackaging -- Part III. Wearable devices packaging and materials -- Chapter 16. Soft Material-Enabled Packaging for Stretchable and Flexible Hybrid Electronics -- Part IV. Biomedical devices packaging -- Chapter 17. Evolution of Advanced Miniaturization for Active Implantable Medical Devices -- Part V. Optical device packaging -- Chapter 18. An introduction of the phosphor converted white LED packaging and its reliability -- Part VI. Energy harvesting -- Chapter 19. Mechanical Energy Harvesting Using Wurtzite Nanowires -- Chapter 20. 1D Nanowire Electrode Materials for Power Sources of Microelectronics -- Part VII. Energy storage (LIB battery) -- Chapter 21. Graphene-based materials with tailored nanostructures for lithium-ion batteries -- Part VIII. Energy storage (supercapacitor) -- Chapter 22. Fe-Based Anode Materials for Asymmetric Supercapacitors -- Part XI. Metrology -- Chapter 23. Nanoscale Deformation and Strain Analysis by AFM/DIC Technique -- Part X. Computational -- Chapter 24. Molecular Dynamics Applications in Packaging -- Chapter 25. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.
520 $a This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
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