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Modeling and application of electrom...

Cheng, Zhiguang.

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Modeling and application of electromagnetic and thermal field in electrical engineering

Record Type:	Electronic resources : Monograph/item
Title/Author:	Modeling and application of electromagnetic and thermal field in electrical engineering/ edited by Zhiguang Cheng, Norio Takahashi, Behzad Forghani.
other author:	Cheng, Zhiguang.
Published:	Singapore :Springer Singapore : : 2020.,
Description:	xxx, 685 p. :ill., digital ;24 cm.
[NT 15003449]:	General Survey -- Low Frequency Electromagnetic Fields and the Finite Element Method -- Some Key Techniques in Electromagnetic and Thermal Field Modeling -- Solution of Coupled Electromagnetic-Thermal Fields -- Development of the APi-based Script -- Harmonic-Balance Finite-Element Method and its Application -- Magnetic Material Modeling -- Measurements of Multi-Directional Anisotropy Using Epstein Frame -- Electromagnetic Properties Modeling Based on Laminated Core Models -- Electromagnetic Properties Modeling Based on Ring Type Core Models -- Magnetic Properties Measurement under Extreme Excitation Conditions -- Problem 21 Benchmark Family and Stray-Field Loss Problems -- Additional Loss caused by the Magnetic Flux Normal to the Plane of Laminations -- Electromagnetic and Thermal Modeling based on Transformer Model -- Modeling DC Bias in Transformers.
Contained By:	Springer eBooks
Subject:	Electrical engineering. -
Online resource:	https://doi.org/10.1007/978-981-15-0173-9
ISBN:	9789811501739

Modeling and application of electromagnetic and thermal field in electrical engineering
Modeling and application of electromagnetic and thermal field in electrical engineering[electronic resource] /edited by Zhiguang Cheng, Norio Takahashi, Behzad Forghani. - Singapore :Springer Singapore :2020. - xxx, 685 p. :ill., digital ;24 cm.

General Survey -- Low Frequency Electromagnetic Fields and the Finite Element Method -- Some Key Techniques in Electromagnetic and Thermal Field Modeling -- Solution of Coupled Electromagnetic-Thermal Fields -- Development of the APi-based Script -- Harmonic-Balance Finite-Element Method and its Application -- Magnetic Material Modeling -- Measurements of Multi-Directional Anisotropy Using Epstein Frame -- Electromagnetic Properties Modeling Based on Laminated Core Models -- Electromagnetic Properties Modeling Based on Ring Type Core Models -- Magnetic Properties Measurement under Extreme Excitation Conditions -- Problem 21 Benchmark Family and Stray-Field Loss Problems -- Additional Loss caused by the Magnetic Flux Normal to the Plane of Laminations -- Electromagnetic and Thermal Modeling based on Transformer Model -- Modeling DC Bias in Transformers.

Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application. it presents important contributions, including advanced and efficient finite element analysis used in the solution of electromagnetic and thermal field problems for large and multi-scale engineering applications involving application script development; magnetic measurement of both magnetic materials and components under various, even extreme conditions, based on well-established (standard and non-standard) experimental systems; and multi-level validation based on both industrial test systems and extended TEAM P21 benchmarking platform. Although these are challenging topics, they are useful for readers from both academia and industry.

ISBN: 9789811501739

Standard No.: 10.1007/978-981-15-0173-9doiSubjects--Topical Terms:

649834
Electrical engineering.

LC Class. No.: TK153 / .M634 2020

Dewey Class. No.: 621.3

Modeling and application of electromagnetic and thermal field in electrical engineering
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245 0 0 $a Modeling and application of electromagnetic and thermal field in electrical engineering $h [electronic resource] / $c edited by Zhiguang Cheng, Norio Takahashi, Behzad Forghani.
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300 $a xxx, 685 p. : $b ill., digital ; $c 24 cm.
505 0 $a General Survey -- Low Frequency Electromagnetic Fields and the Finite Element Method -- Some Key Techniques in Electromagnetic and Thermal Field Modeling -- Solution of Coupled Electromagnetic-Thermal Fields -- Development of the APi-based Script -- Harmonic-Balance Finite-Element Method and its Application -- Magnetic Material Modeling -- Measurements of Multi-Directional Anisotropy Using Epstein Frame -- Electromagnetic Properties Modeling Based on Laminated Core Models -- Electromagnetic Properties Modeling Based on Ring Type Core Models -- Magnetic Properties Measurement under Extreme Excitation Conditions -- Problem 21 Benchmark Family and Stray-Field Loss Problems -- Additional Loss caused by the Magnetic Flux Normal to the Plane of Laminations -- Electromagnetic and Thermal Modeling based on Transformer Model -- Modeling DC Bias in Transformers.
520 $a Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application. it presents important contributions, including advanced and efficient finite element analysis used in the solution of electromagnetic and thermal field problems for large and multi-scale engineering applications involving application script development; magnetic measurement of both magnetic materials and components under various, even extreme conditions, based on well-established (standard and non-standard) experimental systems; and multi-level validation based on both industrial test systems and extended TEAM P21 benchmarking platform. Although these are challenging topics, they are useful for readers from both academia and industry.
650 0 $a Electrical engineering. $3 649834
650 1 4 $a Power Electronics, Electrical Machines and Networks. $3 1001796
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650 2 4 $a Magnetism, Magnetic Materials. $3 893994
650 2 4 $a Engineering Mathematics. $3 3301900
650 2 4 $a Simulation and Modeling. $3 890873
700 1 $a Cheng, Zhiguang. $3 3446342
700 1 $a Takahashi, Norio. $3 3446343
700 1 $a Forghani, Behzad. $3 3446344
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