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Analytical methodology of tree micro...

Ravelo, Blaise.

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Analytical methodology of tree microstrip interconnects modelling for signal distribution = voltage transfer function and s-parameter analyses /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Analytical methodology of tree microstrip interconnects modelling for signal distribution/ edited by Blaise Ravelo.
其他題名:	voltage transfer function and s-parameter analyses /
其他作者:	Ravelo, Blaise.
出版者:	Singapore :Springer Singapore : : 2020.,
面頁冊數:	xiii, 233 p. :ill., digital ;24 cm.
內容註:	General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.
Contained By:	Springer eBooks
標題:	Printed circuits - Mathematical models. -
電子資源:	https://doi.org/10.1007/978-981-15-0552-2
ISBN:	9789811505522

Analytical methodology of tree microstrip interconnects modelling for signal distribution = voltage transfer function and s-parameter analyses /
Analytical methodology of tree microstrip interconnects modelling for signal distributionvoltage transfer function and s-parameter analyses /[electronic resource] :edited by Blaise Ravelo. - Singapore :Springer Singapore :2020. - xiii, 233 p. :ill., digital ;24 cm.

General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.

This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.

ISBN: 9789811505522

Standard No.: 10.1007/978-981-15-0552-2doiSubjects--Topical Terms:

3445329
Printed circuits
--Mathematical models.

LC Class. No.: TK7868.P7 / A535 2020

Dewey Class. No.: 621.381531

Analytical methodology of tree microstrip interconnects modelling for signal distribution = voltage transfer function and s-parameter analyses /
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505 0 $a General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.
520 $a This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
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