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Analytical methodology of tree micro...
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Ravelo, Blaise.
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Analytical methodology of tree microstrip interconnects modelling for signal distribution = voltage transfer function and s-parameter analyses /
Record Type:
Electronic resources : Monograph/item
Title/Author:
Analytical methodology of tree microstrip interconnects modelling for signal distribution/ edited by Blaise Ravelo.
Reminder of title:
voltage transfer function and s-parameter analyses /
other author:
Ravelo, Blaise.
Published:
Singapore :Springer Singapore : : 2020.,
Description:
xiii, 233 p. :ill., digital ;24 cm.
[NT 15003449]:
General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.
Contained By:
Springer eBooks
Subject:
Printed circuits - Mathematical models. -
Online resource:
https://doi.org/10.1007/978-981-15-0552-2
ISBN:
9789811505522
Analytical methodology of tree microstrip interconnects modelling for signal distribution = voltage transfer function and s-parameter analyses /
Analytical methodology of tree microstrip interconnects modelling for signal distribution
voltage transfer function and s-parameter analyses /[electronic resource] :edited by Blaise Ravelo. - Singapore :Springer Singapore :2020. - xiii, 233 p. :ill., digital ;24 cm.
General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
ISBN: 9789811505522
Standard No.: 10.1007/978-981-15-0552-2doiSubjects--Topical Terms:
3445329
Printed circuits
--Mathematical models.
LC Class. No.: TK7868.P7 / A535 2020
Dewey Class. No.: 621.381531
Analytical methodology of tree microstrip interconnects modelling for signal distribution = voltage transfer function and s-parameter analyses /
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voltage transfer function and s-parameter analyses /
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General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.
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This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
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Engineering (Springer-11647)
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W9389535
電子資源
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EB TK7868.P7 A535 2020
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