Modeling and application of flexible...
Huang, YongAn.

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  • Modeling and application of flexible electronics packaging
  • 紀錄類型: 書目-電子資源 : Monograph/item
    正題名/作者: Modeling and application of flexible electronics packaging/ by YongAn Huang, Zhouping Yin, Xiaodong Wan.
    作者: Huang, YongAn.
    其他作者: Yin, Zhouping.
    出版者: Singapore :Springer Singapore : : 2019.,
    面頁冊數: xvii, 287 p. :ill., digital ;24 cm.
    內容註: Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
    Contained By: Springer eBooks
    標題: Flexible electronics. -
    電子資源: https://doi.org/10.1007/978-981-13-3627-0
    ISBN: 9789811336270
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W9373282 電子資源 11.線上閱覽_V 電子書 EB TK7872.F54 H836 2019 一般使用(Normal) 在架 0
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