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Modeling and application of flexible...

Huang, YongAn.

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Modeling and application of flexible electronics packaging

Record Type:	Electronic resources : Monograph/item
Title/Author:	Modeling and application of flexible electronics packaging/ by YongAn Huang, Zhouping Yin, Xiaodong Wan.
Author:	Huang, YongAn.
other author:	Yin, Zhouping.
Published:	Singapore :Springer Singapore : : 2019.,
Description:	xvii, 287 p. :ill., digital ;24 cm.
[NT 15003449]:	Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
Contained By:	Springer eBooks
Subject:	Flexible electronics. -
Online resource:	https://doi.org/10.1007/978-981-13-3627-0
ISBN:	9789811336270

Modeling and application of flexible electronics packaging
Huang, YongAn.

Modeling and application of flexible electronics packaging[electronic resource] /by YongAn Huang, Zhouping Yin, Xiaodong Wan. - Singapore :Springer Singapore :2019. - xvii, 287 p. :ill., digital ;24 cm.

Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

ISBN: 9789811336270

Standard No.: 10.1007/978-981-13-3627-0doiSubjects--Topical Terms:

3315410
Flexible electronics.

LC Class. No.: TK7872.F54 / H836 2019

Dewey Class. No.: 621.381

Modeling and application of flexible electronics packaging
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100 1 $a Huang, YongAn. $3 3251704
245 1 0 $a Modeling and application of flexible electronics packaging $h [electronic resource] / $c by YongAn Huang, Zhouping Yin, Xiaodong Wan.
260 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2019.
300 $a xvii, 287 p. : $b ill., digital ; $c 24 cm.
505 0 $a Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
520 $a This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
650 0 $a Flexible electronics. $3 3315410
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Optical and Electronic Materials. $3 891120
650 2 4 $a Manufacturing, Machines, Tools, Processes. $3 3381528
650 2 4 $a Theoretical and Applied Mechanics. $3 896500
650 2 4 $a Simulation and Modeling. $3 890873
700 1 $a Yin, Zhouping. $3 3299809
700 1 $a Wan, Xiaodong. $3 3409058
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u https://doi.org/10.1007/978-981-13-3627-0
950 $a Engineering (Springer-11647)