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Heterogeneous integrations

Lau, John H.

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Heterogeneous integrations

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Heterogeneous integrations/ by John H. Lau.
作者:	Lau, John H.
出版者:	Singapore :Springer Singapore : : 2019.,
面頁冊數:	xxii, 368 p. :ill. (some col.), digital ;24 cm.
內容註:	Chapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.
Contained By:	Springer eBooks
標題:	Integrated circuits. -
電子資源:	https://doi.org/10.1007/978-981-13-7224-7
ISBN:	9789811372247

Heterogeneous integrations
Lau, John H.

Heterogeneous integrations[electronic resource] /by John H. Lau. - Singapore :Springer Singapore :2019. - xxii, 368 p. :ill. (some col.), digital ;24 cm.

Chapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs) This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

ISBN: 9789811372247

Standard No.: 10.1007/978-981-13-7224-7doiSubjects--Topical Terms:

584067
Integrated circuits.

LC Class. No.: TK7874

Dewey Class. No.: 621.395

Heterogeneous integrations
LDR:02482nmm a2200325 a 4500 001 2180564
003 DE-He213
005 20190403175243.0
006 m d
007 cr nn 008maaau
008 191122s2019 si s 0 eng d
020 $a 9789811372247 $q (electronic bk.)
020 $a 9789811372230 $q (paper)
024 7 $a 10.1007/978-981-13-7224-7 $2 doi
035 $a 978-981-13-7224-7
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.395 $2 23
090 $a TK7874 $b .L366 2019
100 1 $a Lau, John H. $3 858903
245 1 0 $a Heterogeneous integrations $h [electronic resource] / $c by John H. Lau.
260 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2019.
300 $a xxii, 368 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a Chapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.
520 $a Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs) This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
650 0 $a Integrated circuits. $3 584067
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
650 2 4 $a Circuits and Systems. $3 896527
650 2 4 $a Electronic Circuits and Devices. $3 1245773
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u https://doi.org/10.1007/978-981-13-7224-7
950 $a Engineering (Springer-11647)