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Systems-level packaging for Millimet...

Bozanic, Mladen.

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Systems-level packaging for Millimeter-Wave transceivers

Record Type:	Electronic resources : Monograph/item
Title/Author:	Systems-level packaging for Millimeter-Wave transceivers/ by Mladen Bozanic, Saurabh Sinha.
Author:	Bozanic, Mladen.
other author:	Sinha, Saurabh.
Published:	Cham :Springer International Publishing : : 2019.,
Description:	xv, 277 p. :ill., digital ;24 cm.
[NT 15003449]:	Introduction and Research Impact -- Millimeter-Wave Research Challenges -- Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.
Contained By:	Springer eBooks
Subject:	Millimeter wave communication systems. -
Online resource:	https://doi.org/10.1007/978-3-030-14690-0
ISBN:	9783030146900

Systems-level packaging for Millimeter-Wave transceivers
Bozanic, Mladen.

Systems-level packaging for Millimeter-Wave transceivers[electronic resource] /by Mladen Bozanic, Saurabh Sinha. - Cham :Springer International Publishing :2019. - xv, 277 p. :ill., digital ;24 cm. - Smart sensors, measurement and instrumentation,v.342194-8402 ;. - Smart sensors, measurement and instrumentation ;v.34..

Introduction and Research Impact -- Millimeter-Wave Research Challenges -- Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

ISBN: 9783030146900

Standard No.: 10.1007/978-3-030-14690-0doiSubjects--Topical Terms:

827709
Millimeter wave communication systems.

LC Class. No.: TK5103.4835

Dewey Class. No.: 621.384

Systems-level packaging for Millimeter-Wave transceivers
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100 1 $a Bozanic, Mladen. $3 2181239
245 1 0 $a Systems-level packaging for Millimeter-Wave transceivers $h [electronic resource] / $c by Mladen Bozanic, Saurabh Sinha.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2019.
300 $a xv, 277 p. : $b ill., digital ; $c 24 cm.
490 1 $a Smart sensors, measurement and instrumentation, $x 2194-8402 ; $v v.34
505 0 $a Introduction and Research Impact -- Millimeter-Wave Research Challenges -- Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.
520 $a This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
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650 2 4 $a Engineering Design. $3 891033
650 2 4 $a Cyber-physical systems, IoT. $3 3386699
700 1 $a Sinha, Saurabh. $3 2181240
710 2 $a SpringerLink (Online service) $3 836513
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830 0 $a Smart sensors, measurement and instrumentation ; $v v.34. $3 3386697
856 4 0 $u https://doi.org/10.1007/978-3-030-14690-0
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