東華大學圖書館 |

語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

回首頁

切換: 標籤 | MARC模式 | ISBD

Design of Experiment Analysis of an ...

Bajad, Nupur.

FindBook

Google Book

Amazon

博客來

Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis./
作者:	Bajad, Nupur.
出版者:	Ann Arbor : ProQuest Dissertations & Theses, : 2017,
面頁冊數:	66 p.
附註:	Source: Masters Abstracts International, Volume: 57-01.
Contained By:	Masters Abstracts International57-01(E).
標題:	Engineering. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=10682797
ISBN:	9780355507775

Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.
Bajad, Nupur.

Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis. - Ann Arbor : ProQuest Dissertations & Theses, 2017 - 66 p.

Source: Masters Abstracts International, Volume: 57-01.

Thesis (M.S.)--State University of New York at Binghamton, 2017.

design of experiment analysis is reported on data from warpage simulations using finite element analysis of a lidded electronics package. Warpage in a lid of an optical electronics package can detrimentally affect the reliability of the package as well as its optical performance. The present study focuses on the variety of materials and designs of lids relevant to recent technologies in electronics packaging. The finite element analysis (FEA) formulation in this study accurately predicts deformation and warpage in the elastic region with optimal computational time achieved through a choice of boundary conditions and mesh sensitivity studies.

ISBN: 9780355507775Subjects--Topical Terms:

586835
Engineering.

Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.
LDR:02732nmm a2200325 4500 001 2156960
005 20180529081903.5
008 190424s2017 ||||||||||||||||| ||eng d
020 $a 9780355507775
035 $a (MiAaPQ)AAI10682797
035 $a (MiAaPQ)binghamton:12611
035 $a AAI10682797
040 $a MiAaPQ $c MiAaPQ
100 1 $a Bajad, Nupur. $3 3344732
245 1 0 $a Design of Experiment Analysis of an Electronics Package Lid Using Finite Element Analysis.
260 1 $a Ann Arbor : $b ProQuest Dissertations & Theses, $c 2017
300 $a 66 p.
500 $a Source: Masters Abstracts International, Volume: 57-01.
500 $a Advisers: Daryl L. Santos; Sang W. Yoon.
502 $a Thesis (M.S.)--State University of New York at Binghamton, 2017.
520 $a design of experiment analysis is reported on data from warpage simulations using finite element analysis of a lidded electronics package. Warpage in a lid of an optical electronics package can detrimentally affect the reliability of the package as well as its optical performance. The present study focuses on the variety of materials and designs of lids relevant to recent technologies in electronics packaging. The finite element analysis (FEA) formulation in this study accurately predicts deformation and warpage in the elastic region with optimal computational time achieved through a choice of boundary conditions and mesh sensitivity studies.
520 $a The results from FEA are compared to analytical calculations made using the classical laminate plate theory (CLPT) as well as the modified Suhir's theory. It is observed that FEA results are more accurate as they account for the performance of die attach/ underfill materials regardless of the small thickness of the layer. The FEA data are finally used to conduct a design of experiments (DOE) analysis to investigate the influence of 3 distinct designs and 6 material choices on warpage of a lid. The analysis indicates that there is no significant interaction between the two parameters expected to affect the warpage in the lid. Material properties of the lid are found to have a greater effect on the warpage of the lid as compared to variabilities introduced in lid designs in this study. The FEA simulations performed consider only material behavior within the elastic limit and, in some situations, plastic deformation may occur which is more permanent and as such requires a more comprehensive analysis in the plastic region to enhance the data set for DOE studies.
590 $a School code: 0792.
650 4 $a Engineering. $3 586835
650 4 $a Industrial engineering. $3 526216
650 4 $a Systems science. $3 3168411
690 $a 0537
690 $a 0546
690 $a 0790
710 2 $a State University of New York at Binghamton. $b Systems Science Industrial Engineering. $3 2104041
773 0 $t Masters Abstracts International $g 57-01(E).
790 $a 0792
791 $a M.S.
792 $a 2017
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=10682797