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Advanced packaging and manufacturing...

Seok, Seonho.

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Advanced packaging and manufacturing technology based on adhesion engineering = wafer-level transfer packaging and fabrication techniques using interface energy control method /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Advanced packaging and manufacturing technology based on adhesion engineering/ by Seonho Seok.
其他題名:	wafer-level transfer packaging and fabrication techniques using interface energy control method /
作者:	Seok, Seonho.
出版者:	Cham :Springer International Publishing : : 2018.,
面頁冊數:	viii, 115 p. :ill., digital ;24 cm.
內容註:	Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.
Contained By:	Springer eBooks
標題:	Engineering. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-77872-3
ISBN:	9783319778723

Advanced packaging and manufacturing technology based on adhesion engineering = wafer-level transfer packaging and fabrication techniques using interface energy control method /
Seok, Seonho.

Advanced packaging and manufacturing technology based on adhesion engineeringwafer-level transfer packaging and fabrication techniques using interface energy control method /[electronic resource] :by Seonho Seok. - Cham :Springer International Publishing :2018. - viii, 115 p. :ill., digital ;24 cm. - Springer series in advanced manufacturing,1860-5168. - Springer series in advanced manufacturing..

Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies.

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

ISBN: 9783319778723

Standard No.: 10.1007/978-3-319-77872-3doiSubjects--Topical Terms:

586835
Engineering.

LC Class. No.: TJ241 / .S465 2018

Dewey Class. No.: 621.381046

Advanced packaging and manufacturing technology based on adhesion engineering = wafer-level transfer packaging and fabrication techniques using interface energy control method /
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