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3D IC and RF SiPs = advanced stackin...

Hwang, Lih-Tyng.

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3D IC and RF SiPs = advanced stacking and planar solutions for 5G mobility /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	3D IC and RF SiPs/ Lih-Tyng Hwang, Tzyy-Sheng Jason Horng.
其他題名:	advanced stacking and planar solutions for 5G mobility /
作者:	Hwang, Lih-Tyng.
其他作者:	Horng, Tzyy-sheng Jason.
出版者:	Hoboken, NJ :John Wiley & Sons : : 2018.,
面頁冊數:	1 online resource.
內容註:	Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index
標題:	Mobile communication systems - Technological innovations. -
電子資源:	https://onlinelibrary.wiley.com/doi/book/10.1002/9781119289654
ISBN:	9781119289654

3D IC and RF SiPs = advanced stacking and planar solutions for 5G mobility /
Hwang, Lih-Tyng.

3D IC and RF SiPsadvanced stacking and planar solutions for 5G mobility /[electronic resource] :Lih-Tyng Hwang, Tzyy-Sheng Jason Horng. - 1st ed. - Hoboken, NJ :John Wiley & Sons :2018. - 1 online resource.

Includes bibliographical references and index.

Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index

ISBN: 9781119289654

LCCN: 2018000679Subjects--Topical Terms:

595752
Mobile communication systems
--Technological innovations.

LC Class. No.: TK5103.2

Dewey Class. No.: 621.39/5

3D IC and RF SiPs = advanced stacking and planar solutions for 5G mobility /
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505 0 $a Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index
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