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Foundations of heterogeneous integra...

Yazdani, Farhang.

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Foundations of heterogeneous integration = an industry-based, 2.5D/3D pathfinding and co-design approach /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Foundations of heterogeneous integration/ by Farhang Yazdani.
其他題名:	an industry-based, 2.5D/3D pathfinding and co-design approach /
作者:	Yazdani, Farhang.
出版者:	Cham :Springer International Publishing : : 2018.,
面頁冊數:	x, 177 p. :ill. (some col.), digital ;24 cm.
內容註:	Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.
Contained By:	Springer eBooks
標題:	Engineering. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-75769-8
ISBN:	9783319757698

Foundations of heterogeneous integration = an industry-based, 2.5D/3D pathfinding and co-design approach /
Yazdani, Farhang.

Foundations of heterogeneous integrationan industry-based, 2.5D/3D pathfinding and co-design approach /[electronic resource] :by Farhang Yazdani. - Cham :Springer International Publishing :2018. - x, 177 p. :ill. (some col.), digital ;24 cm.

Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.

ISBN: 9783319757698

Standard No.: 10.1007/978-3-319-75769-8doiSubjects--Topical Terms:

586835
Engineering.

LC Class. No.: TK7888.4 / .Y393 2018

Dewey Class. No.: 620.11

Foundations of heterogeneous integration = an industry-based, 2.5D/3D pathfinding and co-design approach /
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