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Contactless VLSI measurement and tes...

Sayil, Selahattin.

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Contactless VLSI measurement and testing techniques

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Contactless VLSI measurement and testing techniques/ by Selahattin Sayil.
作者:	Sayil, Selahattin.
出版者:	Cham :Springer International Publishing : : 2018.,
面頁冊數:	v, 93 p. :ill., digital ;24 cm.
內容註:	1. Conventional Test Methods. - 2. Testability Design -- 3. Other Techniques Based on the Contacting Probe -- 4. Contactless Testing -- 5. Electron-Beam and Photoemission Probing -- 6. Electro Optic Sampling and Charge Density Probe -- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe -- 8. Probing Techniques Based on Light Emission from Chip -- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits -- 10. Comparison of Contactless Testing Methodologies.
Contained By:	Springer eBooks
標題:	Integrated circuits - Very large scale integration. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-69673-7
ISBN:	9783319696737

Contactless VLSI measurement and testing techniques
Sayil, Selahattin.

Contactless VLSI measurement and testing techniques[electronic resource] /by Selahattin Sayil. - Cham :Springer International Publishing :2018. - v, 93 p. :ill., digital ;24 cm.

1. Conventional Test Methods. - 2. Testability Design -- 3. Other Techniques Based on the Contacting Probe -- 4. Contactless Testing -- 5. Electron-Beam and Photoemission Probing -- 6. Electro Optic Sampling and Charge Density Probe -- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe -- 8. Probing Techniques Based on Light Emission from Chip -- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits -- 10. Comparison of Contactless Testing Methodologies.

This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing. The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing.

ISBN: 9783319696737

Standard No.: 10.1007/978-3-319-69673-7doiSubjects--Topical Terms:

535389
Integrated circuits
--Very large scale integration.

LC Class. No.: TK7874.75

Dewey Class. No.: 621.395

Contactless VLSI measurement and testing techniques
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520 $a This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing. The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing.
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