Investigations on microstructure and...
Zhang, Qingke.

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  • Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces
  • 紀錄類型: 書目-電子資源 : Monograph/item
    正題名/作者: Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces/ by Qingke Zhang.
    作者: Zhang, Qingke.
    出版者: Berlin, Heidelberg :Springer Berlin Heidelberg : : 2016.,
    面頁冊數: xv, 143 p. :ill., digital ;24 cm.
    內容註: Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.
    Contained By: Springer eBooks
    標題: Lead-free electronics manufacturing processes - Research. -
    電子資源: http://dx.doi.org/10.1007/978-3-662-48823-2
    ISBN: 9783662488232$q(electronic bk.)
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W9276478 電子資源 11.線上閱覽_V 電子書 EB TK7836 .Z63 2016 一般使用(Normal) 在架 0
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