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Development of infrared techniques f...

Waugh, Rachael C.

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Development of infrared techniques for practical defect identification in bonded joints

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Development of infrared techniques for practical defect identification in bonded joints/ by Rachael C. Waugh.
作者:	Waugh, Rachael C.
出版者:	Cham :Springer International Publishing : : 2016.,
面頁冊數:	xxviii, 149 p. :ill., digital ;24 cm.
內容註:	Introduction -- Adhesive bonding -- Non-destructive evaluation -- The physics and implementation of thermography -- Preliminary results -- Numerical modelling -- Kissing defects -- Practical application of PT/PPT -- Industrial applications -- Conclusions and future work.
Contained By:	Springer eBooks
標題:	Infrared testing. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-22982-9
ISBN:	9783319229829$q(electronic bk.)

Development of infrared techniques for practical defect identification in bonded joints
Waugh, Rachael C.

Development of infrared techniques for practical defect identification in bonded joints[electronic resource] /by Rachael C. Waugh. - Cham :Springer International Publishing :2016. - xxviii, 149 p. :ill., digital ;24 cm. - Springer theses,2190-5053. - Springer theses..

Introduction -- Adhesive bonding -- Non-destructive evaluation -- The physics and implementation of thermography -- Preliminary results -- Numerical modelling -- Kissing defects -- Practical application of PT/PPT -- Industrial applications -- Conclusions and future work.

Maximizing reader insights into the use of thermography, specifically pulsed and pulse phase thermography (PT and PPT), for the identification of kissing defects in adhesive bonds, this thesis focuses on the application of PT and PPT for the identification of a range of defect types in a variety of materials to establish the effect of material properties on identification of defects. Featuring analysis of a numerical model developed to simulate the thermal evolution created during a PT or PPT experiment, after validation through a series of case studies, this model is then used as a predictive tool to relate defect detectability to the thermal property contrast between defect and bulk materials. Demonstrating a means of producing realistic kissing defects in bonded joints where insufficient thermal property contrast exists defects have a limited effect on heat propagation through a component and therefore are not detected using PT or PPT, this thesis discusses the addition of a small load to bonds containing kissing defects which was found to open the defects sufficiently to enable their detection. A low cost infrared detector, Flir Tau320, is compared to the research based photon detector, Flir SC5000, and is shown to be suitable for application in PT, thus enabling a significantly lower cost tool to be developed.

ISBN: 9783319229829$q(electronic bk.)

Standard No.: 10.1007/978-3-319-22982-9doiSubjects--Topical Terms:

2179451
Infrared testing.

LC Class. No.: TA417.5

Dewey Class. No.: 620.1127

Development of infrared techniques for practical defect identification in bonded joints
LDR:02632nmm a2200325 a 4500 001 2028827
003 DE-He213
005 20160726153818.0
006 m d
007 cr nn 008maaau
008 160908s2016 gw s 0 eng d
020 $a 9783319229829$q(electronic bk.)
020 $a 9783319229812$q(paper)
024 7 $a 10.1007/978-3-319-22982-9 $2 doi
035 $a 978-3-319-22982-9
040 $a GP $c GP
041 0 $a eng
050 4 $a TA417.5
072 7 $a TGMT $2 bicssc
072 7 $a TEC021000 $2 bisacsh
082 0 4 $a 620.1127 $2 23
090 $a TA417.5 $b .W354 2016
100 1 $a Waugh, Rachael C. $3 2179450
245 1 0 $a Development of infrared techniques for practical defect identification in bonded joints $h [electronic resource] / $c by Rachael C. Waugh.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2016.
300 $a xxviii, 149 p. : $b ill., digital ; $c 24 cm.
490 1 $a Springer theses, $x 2190-5053
505 0 $a Introduction -- Adhesive bonding -- Non-destructive evaluation -- The physics and implementation of thermography -- Preliminary results -- Numerical modelling -- Kissing defects -- Practical application of PT/PPT -- Industrial applications -- Conclusions and future work.
520 $a Maximizing reader insights into the use of thermography, specifically pulsed and pulse phase thermography (PT and PPT), for the identification of kissing defects in adhesive bonds, this thesis focuses on the application of PT and PPT for the identification of a range of defect types in a variety of materials to establish the effect of material properties on identification of defects. Featuring analysis of a numerical model developed to simulate the thermal evolution created during a PT or PPT experiment, after validation through a series of case studies, this model is then used as a predictive tool to relate defect detectability to the thermal property contrast between defect and bulk materials. Demonstrating a means of producing realistic kissing defects in bonded joints where insufficient thermal property contrast exists defects have a limited effect on heat propagation through a component and therefore are not detected using PT or PPT, this thesis discusses the addition of a small load to bonds containing kissing defects which was found to open the defects sufficiently to enable their detection. A low cost infrared detector, Flir Tau320, is compared to the research based photon detector, Flir SC5000, and is shown to be suitable for application in PT, thus enabling a significantly lower cost tool to be developed.
650 0 $a Infrared testing. $3 2179451
650 0 $a Nondestructive testing. $3 665752
650 1 4 $a Materials Science. $3 890867
650 2 4 $a Characterization and Evaluation of Materials. $3 890988
650 2 4 $a Quality Control, Reliability, Safety and Risk. $3 891027
650 2 4 $a Surface and Interface Science, Thin Films. $3 1244633
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
830 0 $a Springer theses. $3 1314442
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-22982-9
950 $a Chemistry and Materials Science (Springer-11644)