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Heat transfer and pressure drop in f...

Saha, Sujoy Kumar.

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Heat transfer and pressure drop in flow boiling in microchannels

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Heat transfer and pressure drop in flow boiling in microchannels/ by Sujoy Kumar Saha, Gian Piero Celata.
作者:	Saha, Sujoy Kumar.
其他作者:	Celata, Gian Piero.
出版者:	Cham :Springer International Publishing : : 2016.,
面頁冊數:	x, 55 p. :ill. (some col.), digital ;24 cm.
內容註:	1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.
Contained By:	Springer eBooks
標題:	Heat - Transmission. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-20285-3
ISBN:	9783319202853$q(electronic bk.)

Heat transfer and pressure drop in flow boiling in microchannels
Saha, Sujoy Kumar.

Heat transfer and pressure drop in flow boiling in microchannels[electronic resource] /by Sujoy Kumar Saha, Gian Piero Celata. - Cham :Springer International Publishing :2016. - x, 55 p. :ill. (some col.), digital ;24 cm. - SpringerBriefs in applied sciences and technology. Thermal engineering and applied science,2191-530X. - SpringerBriefs in applied sciences and technology.Thermal engineering and applied science..

1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.

This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to "Critical Heat Flux in Flow Boiling in Micro channels," by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.

ISBN: 9783319202853$q(electronic bk.)

Standard No.: 10.1007/978-3-319-20285-3doiSubjects--Topical Terms:

546222
Heat
--Transmission.

LC Class. No.: QC320

Dewey Class. No.: 536.2

Heat transfer and pressure drop in flow boiling in microchannels
LDR:01654nmm a2200325 a 4500 001 2028491
003 DE-He213
005 20160713095044.0
006 m d
007 cr nn 008maaau
008 160908s2016 gw s 0 eng d
020 $a 9783319202853$q(electronic bk.)
020 $a 9783319202846$q(paper)
024 7 $a 10.1007/978-3-319-20285-3 $2 doi
035 $a 978-3-319-20285-3
040 $a GP $c GP
041 0 $a eng
050 4 $a QC320
072 7 $a TGMB $2 bicssc
072 7 $a SCI065000 $2 bisacsh
082 0 4 $a 536.2 $2 23
090 $a QC320 $b .S131 2016
100 1 $a Saha, Sujoy Kumar. $3 2156575
245 1 0 $a Heat transfer and pressure drop in flow boiling in microchannels $h [electronic resource] / $c by Sujoy Kumar Saha, Gian Piero Celata.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2016.
300 $a x, 55 p. : $b ill. (some col.), digital ; $c 24 cm.
490 1 $a SpringerBriefs in applied sciences and technology. Thermal engineering and applied science, $x 2191-530X
505 0 $a 1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.
520 $a This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to "Critical Heat Flux in Flow Boiling in Micro channels," by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.
650 0 $a Heat $x Transmission. $3 546222
650 0 $a Microreactors. $3 1085332
650 1 4 $a Engineering. $3 586835
650 2 4 $a Engineering Thermodynamics, Heat and Mass Transfer. $3 1002079
650 2 4 $a Engineering Fluid Dynamics. $3 891349
650 2 4 $a Fluid- and Aerodynamics. $3 1066670
700 1 $a Celata, Gian Piero. $3 2156576
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
830 0 $a SpringerBriefs in applied sciences and technology. $p Thermal engineering and applied science. $3 2055071
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-20285-3
950 $a Engineering (Springer-11647)