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Three-dimensional integration of sem...

Kondo, Kazuo.

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Three-dimensional integration of semiconductors = processing, materials, and applications /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Three-dimensional integration of semiconductors/ edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
其他題名:	processing, materials, and applications /
其他作者:	Kondo, Kazuo.
出版者:	Cham :Springer International Publishing : : 2015.,
面頁冊數:	xix, 408 p. :ill., digital ;24 cm.
內容註:	Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.
Contained By:	Springer eBooks
標題:	Semiconductors. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-18675-7
ISBN:	9783319186757$q(electronic bk.)

Three-dimensional integration of semiconductors = processing, materials, and applications /
Three-dimensional integration of semiconductorsprocessing, materials, and applications /[electronic resource] :edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi. - Cham :Springer International Publishing :2015. - xix, 408 p. :ill., digital ;24 cm.

Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

ISBN: 9783319186757$q(electronic bk.)

Standard No.: 10.1007/978-3-319-18675-7doiSubjects--Topical Terms:

516162
Semiconductors.

LC Class. No.: TK7874.893

Dewey Class. No.: 621.38152

Three-dimensional integration of semiconductors = processing, materials, and applications /
LDR:01995nmm a2200313 a 4500 001 2016370
003 DE-He213
005 20160516160049.0
006 m d
007 cr nn 008maaau
008 160613s2015 gw s 0 eng d
020 $a 9783319186757$q(electronic bk.)
020 $a 9783319186740$q(paper)
024 7 $a 10.1007/978-3-319-18675-7 $2 doi
035 $a 978-3-319-18675-7
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874.893
072 7 $a PNRH $2 bicssc
072 7 $a SCI013050 $2 bisacsh
082 0 4 $a 621.38152 $2 23
090 $a TK7874.893 $b .T531 2015
245 0 0 $a Three-dimensional integration of semiconductors $h [electronic resource] : $b processing, materials, and applications / $c edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2015.
300 $a xix, 408 p. : $b ill., digital ; $c 24 cm.
505 0 $a Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.
520 $a This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
650 0 $a Semiconductors. $3 516162
650 0 $a Semiconductors $x Materials. $3 553292
650 1 4 $a Chemistry. $3 516420
650 2 4 $a Electrochemistry. $3 557553
650 2 4 $a Electrical Engineering. $3 1001838
650 2 4 $a Mechanical Engineering. $3 891038
650 2 4 $a Biomedical Engineering. $3 720279
700 1 $a Kondo, Kazuo. $3 2056609
700 1 $a Kada, Morihiro. $3 2165461
700 1 $a Takahashi, Kenji. $3 2165462
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-18675-7
950 $a Chemistry and Materials Science (Springer-11644)