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Curves and surfaces = 8th Internatio...

Boissonnat, Jean-Daniel.

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Curves and surfaces = 8th International Conference, Paris, France, June 12-18, 2014 : revised selected papers /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Curves and surfaces/ edited by Jean-Daniel Boissonnat ... [et al.].
其他題名:	8th International Conference, Paris, France, June 12-18, 2014 : revised selected papers /
其他作者:	Boissonnat, Jean-Daniel.
出版者:	Cham :Springer International Publishing : : 2015.,
面頁冊數:	xi, 492 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Simulation and Modeling. -
電子資源:	http://dx.doi.org/10.1007/978-3-319-22804-4
ISBN:	9783319228044

Curves and surfaces = 8th International Conference, Paris, France, June 12-18, 2014 : revised selected papers /
Curves and surfaces8th International Conference, Paris, France, June 12-18, 2014 : revised selected papers /[electronic resource] :edited by Jean-Daniel Boissonnat ... [et al.]. - Cham :Springer International Publishing :2015. - xi, 492 p. :ill., digital ;24 cm. - Lecture notes in computer science,92130302-9743 ;. - Lecture notes in computer science ;5353..

This volume constitutes the thoroughly refereed post-conference proceedings of the 8th International Conference on Curves and Surfaces, held in Paris, France, in June 2014. The conference had the overall theme: "Representation and Approximation of Curves and Surfaces and Applications". The 32 revised full papers presented were carefully reviewed and selected from 39 submissions. The scope of the conference was on following topics: approximation theory, computer-aided geometric design, computer graphics and visualization, computational geometry and topology, geometry processing, image and signal processing, interpolation and smoothing, mesh generation, finite elements and splines, scattered data processing and learning theory, sparse and high-dimensional approximation, subdivision, wavelets and multi-resolution method.

ISBN: 9783319228044

Standard No.: 10.1007/978-3-319-22804-4doiSubjects--Topical Terms:

890873
Simulation and Modeling.

LC Class. No.: T385

Dewey Class. No.: 006.6

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