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Photonic packaging sourcebook = fibe...

Fischer-Hirchert, Ulrich H. P.

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Photonic packaging sourcebook = fiber-chip coupling for optical components, basic calculations, modules /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Photonic packaging sourcebook/ by Ulrich H. P. Fischer-Hirchert.
Reminder of title:	fiber-chip coupling for optical components, basic calculations, modules /
Author:	Fischer-Hirchert, Ulrich H. P.
Published:	Berlin, Heidelberg :Springer Berlin Heidelberg : : 2015.,
Description:	xix, 325 p. :ill., digital ;24 cm.
[NT 15003449]:	Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index.
Contained By:	Springer eBooks
Subject:	Photonics. -
Online resource:	http://dx.doi.org/10.1007/978-3-642-25376-8
ISBN:	9783642253768 (electronic bk.)

Photonic packaging sourcebook = fiber-chip coupling for optical components, basic calculations, modules /
Fischer-Hirchert, Ulrich H. P.

Photonic packaging sourcebookfiber-chip coupling for optical components, basic calculations, modules /[electronic resource] :by Ulrich H. P. Fischer-Hirchert. - Berlin, Heidelberg :Springer Berlin Heidelberg :2015. - xix, 325 p. :ill., digital ;24 cm.

Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index.

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

ISBN: 9783642253768 (electronic bk.)

Standard No.: 10.1007/978-3-642-25376-8doiSubjects--Topical Terms:

526247
Photonics.

LC Class. No.: TA1520

Dewey Class. No.: 621.365

Photonic packaging sourcebook = fiber-chip coupling for optical components, basic calculations, modules /
LDR:02170nmm m2200325 m 4500 001 2001755
003 DE-He213
005 20151126100942.0
006 m d
007 cr nn 008maaau
008 151215s2015 gw s 0 eng d
020 $a 9783642253768 (electronic bk.)
020 $a 9783642253751 (paper)
024 7 $a 10.1007/978-3-642-25376-8 $2 doi
035 $a 978-3-642-25376-8
040 $a GP $c GP
041 0 $a eng
050 4 $a TA1520
072 7 $a TJFN $2 bicssc
072 7 $a TEC024000 $2 bisacsh
072 7 $a TEC030000 $2 bisacsh
082 0 4 $a 621.365 $2 23
090 $a TA1520 $b .F529 2015
100 1 $a Fischer-Hirchert, Ulrich H. P. $3 2145600
245 1 0 $a Photonic packaging sourcebook $h [electronic resource] : $b fiber-chip coupling for optical components, basic calculations, modules / $c by Ulrich H. P. Fischer-Hirchert.
260 $a Berlin, Heidelberg : $b Springer Berlin Heidelberg : $b Imprint: Springer, $c 2015.
300 $a xix, 325 p. : $b ill., digital ; $c 24 cm.
505 0 $a Introduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index.
520 $a This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
650 0 $a Photonics. $3 526247
650 0 $a Photonics $x Materials. $3 535397
650 1 4 $a Engineering. $3 586835
650 2 4 $a Microwaves, RF and Optical Engineering. $3 893985
650 2 4 $a Nanotechnology and Microengineering. $3 1005737
650 2 4 $a Circuits and Systems. $3 896527
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-642-25376-8
950 $a Engineering (Springer-11647)