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A decision support system utilizing ...

DeMars, Justin.

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A decision support system utilizing AHP for solder defect solutions in electronics packaging.

紀錄類型:	書目-語言資料,印刷品 : Monograph/item
正題名/作者:	A decision support system utilizing AHP for solder defect solutions in electronics packaging./
作者:	DeMars, Justin.
面頁冊數:	83 p.
附註:	Source: Masters Abstracts International, Volume: 51-02.
Contained By:	Masters Abstracts International51-02(E).
標題:	Engineering, Industrial. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1516476
ISBN:	9781267545008

A decision support system utilizing AHP for solder defect solutions in electronics packaging.
DeMars, Justin.

A decision support system utilizing AHP for solder defect solutions in electronics packaging. - 83 p.

Source: Masters Abstracts International, Volume: 51-02.

Thesis (M.S.)--State University of New York at Binghamton, 2012.

In the electronics manufacturing industry, interconnections between different components are made via solder joints. These solder joints affect both the quality and reliability of the entire electronic assembly. Defects found within the solder joints create waste of both time and resources. This research utilizes concepts based on lean manufacturing and systems engineering to develop a universal solder defect solution tool for decision support. Numerous journal articles, books, and websites were reviewed to obtain the defect data, causes, and solutions. Analytic hierarchy process was used to rank the defect causes and solutions from most likely to least likely, based on the experience of expert engineers. The developed solder defect solution tool allows the user to select the defect type, which then retrieves the most relevant causes and solutions for that defect from the backend database. Using this tool, engineers and operators will be able to solve solder defect issues more efficiently.

ISBN: 9781267545008Subjects--Topical Terms:

626639
Engineering, Industrial.

A decision support system utilizing AHP for solder defect solutions in electronics packaging.
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500 $a Advisers: Sarah Lam; Ross Havens.
502 $a Thesis (M.S.)--State University of New York at Binghamton, 2012.
520 $a In the electronics manufacturing industry, interconnections between different components are made via solder joints. These solder joints affect both the quality and reliability of the entire electronic assembly. Defects found within the solder joints create waste of both time and resources. This research utilizes concepts based on lean manufacturing and systems engineering to develop a universal solder defect solution tool for decision support. Numerous journal articles, books, and websites were reviewed to obtain the defect data, causes, and solutions. Analytic hierarchy process was used to rank the defect causes and solutions from most likely to least likely, based on the experience of expert engineers. The developed solder defect solution tool allows the user to select the defect type, which then retrieves the most relevant causes and solutions for that defect from the backend database. Using this tool, engineers and operators will be able to solve solder defect issues more efficiently.
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650 4 $a Engineering, Packaging. $3 1025152
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