東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back

Switch To: Labeled | MARC Mode | ISBD

Development of Nanowire Structures o...

Yao, Zhonghua.

Linked to FindBook

Google Book

Amazon

博客來

Development of Nanowire Structures on 2D and 3D Substrates for Pool Boiling Heat Transfer Enhancement.

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Development of Nanowire Structures on 2D and 3D Substrates for Pool Boiling Heat Transfer Enhancement./
Author:	Yao, Zhonghua.
Description:	152 p.
Notes:	Source: Dissertation Abstracts International, Volume: 74-10(E), Section: B.
Contained By:	Dissertation Abstracts International74-10B(E).
Subject:	Engineering, General. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3565295
ISBN:	9781303148743

Development of Nanowire Structures on 2D and 3D Substrates for Pool Boiling Heat Transfer Enhancement.
Yao, Zhonghua.

Development of Nanowire Structures on 2D and 3D Substrates for Pool Boiling Heat Transfer Enhancement. - 152 p.

Source: Dissertation Abstracts International, Volume: 74-10(E), Section: B.

Thesis (Ph.D.)--Rochester Institute of Technology, 2013.

Boiling is a common mechanism for liquid-vapor phase transition and is widely exploited in power generation, refrigeration and many other systems. The efficacy of boiling heat transfer is characterized by two parameters: (a) heat transfer coefficient (HTC) or the thermal conductance; (b) the critical heat flux (CHF). Increasing the CHF and the HTC has significant impacts on system-level energy efficiency, safety and cost. As the surface modification at nano-scale has proven to be an effective approach to improve pool boiling heat transfer, the enhancement due to combination of nanomaterials with micro-scale structures on boiling heat transfer is an area of current interest. In this study, metallic- and semiconductor- material based nanowire structures were fabricated and studied for boiling enhancement. A new technique is developed to directly grow Cu nanowire (CuNW) on Si substrate with electro-chemical deposition, and to produce height-controlled hydrophilic nanowired surfaces. Using a two-step electroless etching process, silicon nanowire (SiNW) have been selectively fabricated on top, bottom, and sidewall surfaces of silicon microchannels. An array of the SiNW coated microchannels functioned as a heat sink and was investigated for its pool boiling performance with water. This microchannel heat sink yielded superior boiling performance compared to a sample substrate with only microchannels and a plain substrate with nanowires. The enhancement was associated with the area covered by SiNWs. The sidewalls with SiNWs greatly affected bubble dynamics, resulting in a significant performance enhancement. The maximum heat flux of the microchannel with SiNW on all surfaces was improved by 150% over the microchannel-only heat sink and by more than 400% over a plain silicon substrate. These results provide a viable solution to meet the demands for dissipating a high heat transfer rate in a compact space, with additional insight gained into the boiling mechanism for the microchannel heat sinks with nanostructures.

ISBN: 9781303148743Subjects--Topical Terms:

1020744
Engineering, General.

Development of Nanowire Structures on 2D and 3D Substrates for Pool Boiling Heat Transfer Enhancement.
LDR:02950nam a2200277 4500 001 1960325
005 20140611111835.5
008 150210s2013 ||||||||||||||||| ||eng d
020 $a 9781303148743
035 $a (MiAaPQ)AAI3565295
035 $a AAI3565295
040 $a MiAaPQ $c MiAaPQ
100 1 $a Yao, Zhonghua. $3 2095957
245 1 0 $a Development of Nanowire Structures on 2D and 3D Substrates for Pool Boiling Heat Transfer Enhancement.
300 $a 152 p.
500 $a Source: Dissertation Abstracts International, Volume: 74-10(E), Section: B.
500 $a Adviser: Satish Kandlikar.
502 $a Thesis (Ph.D.)--Rochester Institute of Technology, 2013.
520 $a Boiling is a common mechanism for liquid-vapor phase transition and is widely exploited in power generation, refrigeration and many other systems. The efficacy of boiling heat transfer is characterized by two parameters: (a) heat transfer coefficient (HTC) or the thermal conductance; (b) the critical heat flux (CHF). Increasing the CHF and the HTC has significant impacts on system-level energy efficiency, safety and cost. As the surface modification at nano-scale has proven to be an effective approach to improve pool boiling heat transfer, the enhancement due to combination of nanomaterials with micro-scale structures on boiling heat transfer is an area of current interest. In this study, metallic- and semiconductor- material based nanowire structures were fabricated and studied for boiling enhancement. A new technique is developed to directly grow Cu nanowire (CuNW) on Si substrate with electro-chemical deposition, and to produce height-controlled hydrophilic nanowired surfaces. Using a two-step electroless etching process, silicon nanowire (SiNW) have been selectively fabricated on top, bottom, and sidewall surfaces of silicon microchannels. An array of the SiNW coated microchannels functioned as a heat sink and was investigated for its pool boiling performance with water. This microchannel heat sink yielded superior boiling performance compared to a sample substrate with only microchannels and a plain substrate with nanowires. The enhancement was associated with the area covered by SiNWs. The sidewalls with SiNWs greatly affected bubble dynamics, resulting in a significant performance enhancement. The maximum heat flux of the microchannel with SiNW on all surfaces was improved by 150% over the microchannel-only heat sink and by more than 400% over a plain silicon substrate. These results provide a viable solution to meet the demands for dissipating a high heat transfer rate in a compact space, with additional insight gained into the boiling mechanism for the microchannel heat sinks with nanostructures.
590 $a School code: 0465.
650 4 $a Engineering, General. $3 1020744
650 4 $a Engineering, Mechanical. $3 783786
690 $a 0537
690 $a 0548
710 2 $a Rochester Institute of Technology. $b Microsystems Engineering. $3 1023613
773 0 $t Dissertation Abstracts International $g 74-10B(E).
790 $a 0465
791 $a Ph.D.
792 $a 2013
793 $a English
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3565295