東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back

Switch To: Labeled | MARC Mode | ISBD

The role of soldering process variab...

Rowley, Jonathan Gabriel.

Linked to FindBook

Google Book

Amazon

博客來

The role of soldering process variables on properties of lead-free solder joints.

Record Type:	Electronic resources : Monograph/item
Title/Author:	The role of soldering process variables on properties of lead-free solder joints./
Author:	Rowley, Jonathan Gabriel.
Description:	157 p.
Notes:	Source: Masters Abstracts International, Volume: 42-03, page: 1035.
Contained By:	Masters Abstracts International42-03.
Subject:	Engineering, Materials Science. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1416877

The role of soldering process variables on properties of lead-free solder joints.
Rowley, Jonathan Gabriel.

The role of soldering process variables on properties of lead-free solder joints. - 157 p.

Source: Masters Abstracts International, Volume: 42-03, page: 1035.

Thesis (M.S.E.)--The University of Texas at Arlington, 2003.

This paper reports some new experimental findings and analysis on the tensile fracture strength of solder joints made with the lead-free solder alloys 96.5Sn3.5Ag, 95.5Sn4.0Ag0.5Cu and 96.5Sn3.0Ag0.5Cu using convection reflow soldering techniques. The employed specimens were all sandwiched solder joint assemblies subjected to various reflow soldering process variables: reflow temperature, reflow time, cooling rate and joint thickness. It was found that reflow time was the most important process variable in determining joint strength. The joint strength decreases rapidly with increasing reflow time. Cooling rates alter the reflow time, thus altering the joint strength. Faster cooling rates increased joint strength. Typically, a 20°C band in which peak reflow is to occur is used when processing electronic assemblies. Strength variations were found to be broad over such a band. Peak temperature needs to be precise to optimize strength. Joint strength in correlation with joint thickness was found to be random. Thin joints produced results better than thick joints and vice versa under similar testing conditions. Joint fracture strengths over 150% greater than recorded bulk solder tensile strengths were found. The method by which a joint was processed aided in the morphology of the intermetallic compound (IMC) formed in the joint. The shape and size of the intermetallic whiskers and scallops truly dictate joint strength. Porosity is inherent to joints made with a solder paste. Porosity can be controlled by the process conditions. Minimizing the fraction of the surface area covered by pores will result in stronger joints. The pore size, shape and movement were found to be controlled by IMC formation and subsequent dissolution from around the pore.Subjects--Topical Terms:

1017759
Engineering, Materials Science.

The role of soldering process variables on properties of lead-free solder joints.
LDR:02653nmm 2200277 4500 001 1866244
005 20041220114137.5
008 130614s2003 eng d
035 $a (UnM)AAI1416877
035 $a AAI1416877
040 $a UnM $c UnM
100 1 $a Rowley, Jonathan Gabriel. $3 1953651
245 1 4 $a The role of soldering process variables on properties of lead-free solder joints.
300 $a 157 p.
500 $a Source: Masters Abstracts International, Volume: 42-03, page: 1035.
500 $a Supervisor: Pranesh Aswath.
502 $a Thesis (M.S.E.)--The University of Texas at Arlington, 2003.
520 $a This paper reports some new experimental findings and analysis on the tensile fracture strength of solder joints made with the lead-free solder alloys 96.5Sn3.5Ag, 95.5Sn4.0Ag0.5Cu and 96.5Sn3.0Ag0.5Cu using convection reflow soldering techniques. The employed specimens were all sandwiched solder joint assemblies subjected to various reflow soldering process variables: reflow temperature, reflow time, cooling rate and joint thickness. It was found that reflow time was the most important process variable in determining joint strength. The joint strength decreases rapidly with increasing reflow time. Cooling rates alter the reflow time, thus altering the joint strength. Faster cooling rates increased joint strength. Typically, a 20°C band in which peak reflow is to occur is used when processing electronic assemblies. Strength variations were found to be broad over such a band. Peak temperature needs to be precise to optimize strength. Joint strength in correlation with joint thickness was found to be random. Thin joints produced results better than thick joints and vice versa under similar testing conditions. Joint fracture strengths over 150% greater than recorded bulk solder tensile strengths were found. The method by which a joint was processed aided in the morphology of the intermetallic compound (IMC) formed in the joint. The shape and size of the intermetallic whiskers and scallops truly dictate joint strength. Porosity is inherent to joints made with a solder paste. Porosity can be controlled by the process conditions. Minimizing the fraction of the surface area covered by pores will result in stronger joints. The pore size, shape and movement were found to be controlled by IMC formation and subsequent dissolution from around the pore.
590 $a School code: 2502.
650 4 $a Engineering, Materials Science. $3 1017759
650 4 $a Engineering, Metallurgy. $3 1023648
650 4 $a Engineering, Mechanical. $3 783786
690 $a 0794
690 $a 0743
690 $a 0548
710 2 0 $a The University of Texas at Arlington. $3 1025869
773 0 $t Masters Abstracts International $g 42-03.
790 1 0 $a Aswath, Pranesh, $e advisor
790 $a 2502
791 $a M.S.E.
792 $a 2003
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1416877