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Wetting studies of lead-free solders...

Sattiraju, Seshagirirao Venkata.

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Wetting studies of lead-free solders on lead-free PWB finishes.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Wetting studies of lead-free solders on lead-free PWB finishes./
Author:	Sattiraju, Seshagirirao Venkata.
Description:	192 p.
Notes:	Source: Dissertation Abstracts International, Volume: 63-06, Section: B, page: 2971.
Contained By:	Dissertation Abstracts International63-06B.
Subject:	Engineering, Materials Science. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3057162
ISBN:	0493725822

Wetting studies of lead-free solders on lead-free PWB finishes.
Sattiraju, Seshagirirao Venkata.

Wetting studies of lead-free solders on lead-free PWB finishes. - 192 p.

Source: Dissertation Abstracts International, Volume: 63-06, Section: B, page: 2971.

Thesis (Ph.D.)--Auburn University, 2002.

There is a universal focus for producing environmentally friendly products in many different areas of science and engineering. Pb in electronic solder has become the target recently. The shift towards Pb-free manufacturing is a complicated issue. For a successful transition to Pb-free manufacturing in electronics assembly, it is critical to understand the behavior of Pb-free solders (in bulk and paste form) and their interaction with the Pb-free printed wiring board (PWB) finishes before their implementation in high volume electronics manufacturing can be realized.

ISBN: 0493725822Subjects--Topical Terms:

1017759
Engineering, Materials Science.

Wetting studies of lead-free solders on lead-free PWB finishes.
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020 $a 0493725822
035 $a (UnM)AAI3057162
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100 1 $a Sattiraju, Seshagirirao Venkata. $3 1953024
245 1 0 $a Wetting studies of lead-free solders on lead-free PWB finishes.
300 $a 192 p.
500 $a Source: Dissertation Abstracts International, Volume: 63-06, Section: B, page: 2971.
500 $a Director: R. Wayne Johnson.
502 $a Thesis (Ph.D.)--Auburn University, 2002.
520 $a There is a universal focus for producing environmentally friendly products in many different areas of science and engineering. Pb in electronic solder has become the target recently. The shift towards Pb-free manufacturing is a complicated issue. For a successful transition to Pb-free manufacturing in electronics assembly, it is critical to understand the behavior of Pb-free solders (in bulk and paste form) and their interaction with the Pb-free printed wiring board (PWB) finishes before their implementation in high volume electronics manufacturing can be realized.
520 $a In this research work, studies were performed to characterize the wetting process of some Pb-free solders and Pb-free PWB finishes. Results obtained from solder paste spread tests and wetting balance experiments with several Pb-free solder alloys and Pb-free PWB finishes are presented and conclusions are drawn on the solderability of the alloys and finishes. The solder alloys studied were Sn3.4Ag4.8Bi, Sn4.0Ag0.5 Cu, Sn3.5Ag and Sn0.7Cu. Eutectic Sn37Pb was used as a reference. The PWB surface finishes were immersion Sn, electroless Ni/immersion Au, immersion Ag and organic solderability preservative (OSP). Effects of multiple reflow cycles on solderability of the test coupons were also studied. Statistical analyses were performed on the data obtained from the wetting balance and spread tests.
520 $a Wetting balance experiments were conducted in air while the spread tests were performed in air and nitrogen to understand the effect of reflow atmosphere on the spreading. Surface analyses techniques such as Auger Electron Spectroscopy (AES) and X-ray Photoelectron Spectroscopy (XPS) were applied to understand and analyze the surfaces. Conclusions were drawn based on the data obtained from the wetting balance and spread experiments and results from the surface and thermodynamic analyses were applied to augment the experimental results. Sequential Electrochemical Reduction Analysis (SERA) was also performed on the as-received, aged and after multiple reflow cycles on Sn PWB test coupons to understand their effect on the growth of oxides and intermetallic compounds. Sn is the best finish in the as-received, unaged condition with all the Pb-free solders tested. It loses its solderability after extended storage and after multiple reflow cycles. The Sn finish is also cheaper compared to other alternatives such as Ag and Ni/Au finishes. Ni/Au and Ag finishes appear to be equal after multiple reflow cycles with all Pb-free solders tested.
520 $a Halo formation was observed on Ni/Au board finishes with certain solder alloys. Many investigations such as line scans and spot chemical analysis were conducted on the halo to understand the mechanism involved. It was concluded that the halo formation was due to the formation of the Au-Sn intermetallic compounds.
520 $a Finally, growth of intermetallic compounds at different aging temperatures for different combinations of solders and finishes has been studied and is reported. It appears that the modeling of the growth of IMCs on Sn and Ag PWB finishes based on a completely parabolic growth model may be insufficient. Diffusion is the predominant mechanism for the growth of the Ni-Sn IMCs. NiAu finish has the least thickness of the total intermetallic layer.
590 $a School code: 0012.
650 4 $a Engineering, Materials Science. $3 1017759
650 4 $a Engineering, Metallurgy. $3 1023648
650 4 $a Engineering, Electronics and Electrical. $3 626636
690 $a 0794
690 $a 0743
690 $a 0544
710 2 0 $a Auburn University. $3 1020457
773 0 $t Dissertation Abstracts International $g 63-06B.
790 1 0 $a Johnson, R. Wayne, $e advisor
790 $a 0012
791 $a Ph.D.
792 $a 2002
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3057162