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Solid state diffusion kinetics of in...

Sees, Jennifer Anne.

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Solid state diffusion kinetics of intermetallic compound formation in composite solders.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Solid state diffusion kinetics of intermetallic compound formation in composite solders./
作者:	Sees, Jennifer Anne.
面頁冊數:	170 p.
附註:	Source: Dissertation Abstracts International, Volume: 54-05, Section: B, page: 2500.
Contained By:	Dissertation Abstracts International54-05B.
標題:	Chemistry, Inorganic. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9326655

Solid state diffusion kinetics of intermetallic compound formation in composite solders.
Sees, Jennifer Anne.

Solid state diffusion kinetics of intermetallic compound formation in composite solders. - 170 p.

Source: Dissertation Abstracts International, Volume: 54-05, Section: B, page: 2500.

Thesis (Ph.D.)--University of North Texas, 1993.

The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (CuSubjects--Topical Terms:

517253
Chemistry, Inorganic.

Solid state diffusion kinetics of intermetallic compound formation in composite solders.
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100 1 $a Sees, Jennifer Anne. $3 1952922
245 1 0 $a Solid state diffusion kinetics of intermetallic compound formation in composite solders.
300 $a 170 p.
500 $a Source: Dissertation Abstracts International, Volume: 54-05, Section: B, page: 2500.
500 $a Major Professor: James L. Marshall.
502 $a Thesis (Ph.D.)--University of North Texas, 1993.
520 $a The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (Cu $\ sb6 $\ sb5 $ and Cu $\ sb3 $\ sb6 $\ sb5 $, 20 wt.% Cu $\ sb3 $\ sb6 $\ sb5 $ formation and decreased energies for Cu $\ sb3 $\ sb3 $\ sb6 $\ sb5 $ formation. Phases were also characterized at the nanostructural level by transmission electron microscopy; it was found possible to prepare specimens for analysis based on a novel embedding formulation and the technique of ultramicrotomy. Additionally, an X-ray photoelectron spectroscopy study was conducted in order to ascertain the nature of thermally grown surface oxides. Surface SnO $\ sb{\rm x} $/ PbO $\ sb{\rm x} $ was found to decrease with time at elevated temperatures.
590 $a School code: 0158.
650 4 $a Chemistry, Inorganic. $3 517253
650 4 $a Engineering, Materials Science. $3 1017759
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0488
690 $a 0794
690 $a 0549
710 2 0 $a University of North Texas. $3 1017396
773 0 $t Dissertation Abstracts International $g 54-05B.
790 1 0 $a Marshall, James L., $e advisor
790 $a 0158
791 $a Ph.D.
792 $a 1993
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9326655