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Electromagnetic modeling with a new ...
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Shao, Xi.
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Electromagnetic modeling with a new three-dimensional alternating-direction-implicit (ADI) Maxwell equation solver.
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
Electromagnetic modeling with a new three-dimensional alternating-direction-implicit (ADI) Maxwell equation solver./
作者:
Shao, Xi.
面頁冊數:
84 p.
附註:
Source: Masters Abstracts International, Volume: 43-01, page: 0285.
Contained By:
Masters Abstracts International43-01.
標題:
Engineering, Electronics and Electrical. -
電子資源:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1421422
ISBN:
0496261673
Electromagnetic modeling with a new three-dimensional alternating-direction-implicit (ADI) Maxwell equation solver.
Shao, Xi.
Electromagnetic modeling with a new three-dimensional alternating-direction-implicit (ADI) Maxwell equation solver.
- 84 p.
Source: Masters Abstracts International, Volume: 43-01, page: 0285.
Thesis (M.S.)--University of Maryland, College Park, 2004.
We introduce a time-domain method to simulate the digital signal propagation along on-chip interconnects, aperture radiation, and indoor-communication by solving the Maxwell equation with the Alternating-Direction-Implicit (ADI) method. With this method, we are able to resolve the large scale (i.e. electromagnetic wave propagation) and fine scale (i.e. metal skin depth, substrate current, coating material) structure in the same simulation, and the simulation time step is not limited by the Courant condition. The simulations allow us to calculate in detail parasitic current flow inside the substrate; propagation losses, skin-depth and dispersion of digital signals on non-ideal interconnects; detailed surface current and standing wave pattern in aperture radiation problem; signal power map and propagation delay in complicated in-door communication scenarios.
ISBN: 0496261673Subjects--Topical Terms:
626636
Engineering, Electronics and Electrical.
Electromagnetic modeling with a new three-dimensional alternating-direction-implicit (ADI) Maxwell equation solver.
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We introduce a time-domain method to simulate the digital signal propagation along on-chip interconnects, aperture radiation, and indoor-communication by solving the Maxwell equation with the Alternating-Direction-Implicit (ADI) method. With this method, we are able to resolve the large scale (i.e. electromagnetic wave propagation) and fine scale (i.e. metal skin depth, substrate current, coating material) structure in the same simulation, and the simulation time step is not limited by the Courant condition. The simulations allow us to calculate in detail parasitic current flow inside the substrate; propagation losses, skin-depth and dispersion of digital signals on non-ideal interconnects; detailed surface current and standing wave pattern in aperture radiation problem; signal power map and propagation delay in complicated in-door communication scenarios.
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http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1421422
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