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Three dimensional electromagnetic FD...

Falconer, Maynard Carver.

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Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing./
作者:	Falconer, Maynard Carver.
面頁冊數:	137 p.
附註:	Source: Dissertation Abstracts International, Volume: 58-05, Section: B, page: 2576.
Contained By:	Dissertation Abstracts International58-05B.
標題:	Engineering, Electronics and Electrical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9734017
ISBN:	0591436884

Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing.
Falconer, Maynard Carver.

Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing. - 137 p.

Source: Dissertation Abstracts International, Volume: 58-05, Section: B, page: 2576.

Thesis (Ph.D.)--Oregon State University, 1997.

A new second order accurate nonuniform grid spacing technique which does not depend on supraconvergence is developed for Finite Difference Time Domain (FDTD) simulation of general three dimensional structures. The technique is useful for FDTD simulations of systems which require finer details in small regions of the simulation space by providing the ability to utilize nonuniform grid spacing. The stability conditions of the new technique are derived and shown to be consistent with uniform grid formulation and the accuracy of the technique is investigated and shown to be second order. The advantage of the new technique is that it allows for greater simulation detail while reducing the computational and memory requirements compared to the current uniform grid FDTD techniques.

ISBN: 0591436884Subjects--Topical Terms:

626636
Engineering, Electronics and Electrical.

Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing.
LDR:03030nmm 2200289 4500 001 1841431
005 20050907145129.5
008 130614s1997 eng d
020 $a 0591436884
035 $a (UnM)AAI9734017
035 $a AAI9734017
040 $a UnM $c UnM
100 1 $a Falconer, Maynard Carver. $3 1929731
245 1 0 $a Three dimensional electromagnetic FDTD simulation of general lossy structures with nonuniform grid spacing.
300 $a 137 p.
500 $a Source: Dissertation Abstracts International, Volume: 58-05, Section: B, page: 2576.
502 $a Thesis (Ph.D.)--Oregon State University, 1997.
520 $a A new second order accurate nonuniform grid spacing technique which does not depend on supraconvergence is developed for Finite Difference Time Domain (FDTD) simulation of general three dimensional structures. The technique is useful for FDTD simulations of systems which require finer details in small regions of the simulation space by providing the ability to utilize nonuniform grid spacing. The stability conditions of the new technique are derived and shown to be consistent with uniform grid formulation and the accuracy of the technique is investigated and shown to be second order. The advantage of the new technique is that it allows for greater simulation detail while reducing the computational and memory requirements compared to the current uniform grid FDTD techniques.
520 $a Additionally, the derivation of the expressions associated with the inclusion of material properties in the FDTD simulation with nonuniform grids is presented allowing for the development of a nonuniform FDTD simulator for general lossy 3D systems associated with on and off chip interconnects, electronic packages and microwave circuits. In order to illustrate the utility of this simulator, time domain electromagnetic simulation of a 3-D lossy interconnect structure associated with a generic surface mount IC package is presented. The time domain currents and fields are computed in the structure to investigate ground bounce, signal degradation, and crosstalk associated with the interconnects and packaging structure. The supply plane conductivities are included in the simulation allowing the observation of the current densities in the power/ground planes as a function of time.
520 $a Finally, the FDTD simulation tool is proposed and used as a Virtual TDR (V-TDR) to extract the circuit models associated with complex 3D structures. The time domain response of a multiport structure is used to extract the equivalent circuit parameters to characterize the multiport by using the multiport time domain reflection (TDR) based general deconvolution algorithm. Examples of coupled interconnects and transmission lines are presented to illustrate this technique.
590 $a School code: 0172.
650 4 $a Engineering, Electronics and Electrical. $3 626636
650 4 $a Physics, Electricity and Magnetism. $3 1019535
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0544
690 $a 0607
690 $a 0549
710 2 0 $a Oregon State University. $3 625720
773 0 $t Dissertation Abstracts International $g 58-05B.
790 $a 0172
791 $a Ph.D.
792 $a 1997
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9734017